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PCB design specifications and SMT processing
PCB design specifications and SMT processing

PCB design specifications and SMT processing


In order to standardize the PCB process design of the product, the relevant parameters of the PCB process design are specified, so that the PCB design meets the technical specification requirements of manufacturability, testability, safety regulations, EMC, EMI, etc., and the process of building the product during the product design process, Technology, quality and cost advantages. 2. Scope of application This specification applies to PCB process design of all electronic products, and is used in but not limited to PCB design, PCB board process review, single board process review and other activities. If the content of relevant standards and specifications before this specification conflict with the provisions of this specification, this specification shall prevail. 3. Definition Via: A metallized hole used for inner layer connection, but it is not used for inserting component leads or other reinforcing materials. Blind via: A via hole extending from the inside of the printed board to only one surface layer. Buried via: A via hole that does not extend to the surface of the printed board. Through hole (Through via): a through hole extending from one surface layer of the printed board to another surface layer. Component hole: A hole used to fix the component terminal on the printed board and electrically connect the conductive pattern. Stand off: The vertical distance from the bottom of the body of the surface mount device to the bottom of the pin. 4. Quotation/reference standard or material TS-S0902010001 <> TS-SOE0199001 <> TS-SOE0199002 <> IEC60194 <> (Printed Circuit Board design manufacture and assembly-terms and definitions) IPC-A-600F <

pcb board

What is SMT processing

SMT processing means that the electronic client provides materials to the electronic processing party for PCB processing and production due to insufficient equipment and technical experience. This is also the electronic processing service required by most electronic developers, which saves a large amount of capital investment and factory rent for electronic developers, which undoubtedly reduces production costs and increases the added value of products. Lingxinte Technology is a chip processing manufacturer with more than ten years of processing experience. It strictly implements the international ISO9001 standard for production. It specializes in providing various electronic processing services, such as PCBA processing, SMT patch, DIP plug-in and finished product assembly. Your pursuit of quality is our production standard.

SMT processing flow

Quality is always the ultimate requirement of all electronic product processing. The same is true for SMT processing. Lingxinte Technology uses the most professional processing equipment, plant settings and production process control to ensure product quality. Next, we will give you a detailed introduction to the process of SMT processing.

1. The two parties conduct detailed negotiations on the processing project and sign a cooperation contract after confirming that they are correct.

2. The client submits PCB documents, BOM and component materials, etc. The PCB documents and BOM are used to confirm the accuracy of the component mounting direction and materials;

3. Incoming material inspection and processing. IQC testing of materials is carried out to ensure the quality of production. Some components need to be processed, such as material trimming, component forming, etc.;

4. On-line production. The first piece will be proofed before going online, and mass production will be carried out after both parties confirm that they are correct. During the process, stencil production, solder paste printing, PCB component placement, reflow process and red glue process will be carried out.