Rogers RO4350B RF Printed Circuit Board

Rogers ro4350b high frequency PCB

Ro4350b is a patented hydrocarbon resin system / ceramic filler reinforced by woven glass cloth. Its electrical properties are very close to PTFE / woven glass cloth material, and its machinability is similar to that of epoxy resin / glass cloth material.

The ro4350b can use the standard epoxy / glass cloth processing technology, while providing strictly controlled permittivity and loss at a fraction of the price of traditional microwave materials. There is no need for special through-hole pretreatment or operation procedures like PTFE based microwave materials.

Ro4350b material has passed UL 94V-0 fire rating for active equipment and high voltage RF design.

Real Project display:

Rogers RO4350B Advantages:

1. Low DF
2. Low DK fluctuates with temperature
3. Low Z axis thermal expansion coefficient
4. Low internal expansion coefficient
5. Low DK tolerance
6. Stable electrical characteristics at different frequencies
7. Easy for mass production and multi-layer mixing of FR4, high cost performance

Typical applications:Cellular base station antenna and power amplifier, Microwave point to point connection (P2P), Automotive radar and sensors, Radio frequency identification (RFID) tags, LNB for live satellite

RO4000 Series Materials Dielectric Constant VS. Temperature

RF/Microwave PCB application

PCB printed circuit boards with radio frequency(RF PCBs) are an increasingly used technique within the PCB industry.

--RF PCB with a high frequency with works above 100 MHz.

--Microwave PCB with works above 2 GHz radio frequency.

RF-pcb’s are used in different applications such as remote controls(wireless controls)security,smartphones,sensors etc.

New technologies make more and more use of these RF applications.

This asks for a manufacturing according to high quality standards and choosing the right RF materials depending on the application.

It is important that one knows the properties of the various materials.Choosing the right material is perhaps the most critical decision in the production process of the RF PCB.