PCB Material List - Shengyi S1170G Datasheet

Shengyi S1170G is a halogen-free PCB high TG PCB circuit board.

Shengyi S1170G features: CAF resistance, lead-free compatibility, excellent through-hole reliability, halogen-free, antimony, red phosphorus and other components

Shengyi S1170G application areas: consumer electronics, smartphones, automotive electronics, computers, instruments and meters

Shengyi S1170G Datasheet

Shengyi S1170G Datasheet

Storage method for S1170G copper-clad board: Place it in its original packaging on a platform or suitable rack to avoid heavy pressure and prevent deformation of the board due to improper storage.

Storage environment for S1170G copper-clad board: The board should be stored in a ventilated, dry, and room temperature environment, avoiding direct sunlight, rain, and corrosive gas corrosion (direct impact of storage environment)

Sound board quality); The dual panel can be stored for two years in a suitable environment, and the single panel can be stored for one year in a suitable environment, and its internal performance can meet the requirements of IPC4101 standard.

S1170G copper-clad laminate operation: Wear clean gloves and handle the board carefully. Collisions, sliding, etc. can damage the copper foil; Bare hand operation can contaminate the copper foil surface, and these defects may affect the board

The use of materials causes adverse effects.

S1170G Prepreg storage method: Store the Prepreg horizontally in its original packaging to avoid heavy pressure and prevent damage caused by improper storage methods; The remaining roll shaped Prepreg after cutting still needs to be sealed and packaged with cling film, and placed back on the original packaging rack.

S1170G Prepreg storage environment: Prepreg should be stored in sealed packaging in an environment without exposure to ultraviolet light. The specific storage conditions and storage period are as follows:

Condition 1: Temperature<23 ℃, relative humidity<50%, storage period of 3 months;

Condition 2: Temperature<5 ℃, storage period of 6 months;

Relative humidity has a significant impact on the quality of Prepreg, and corresponding dehumidification treatment should be carried out when the weather is humid. It is recommended to use Prepreg within 3 days after opening the packaging.

S1170G Prepreg cutting operation: Cutting is best done by professionals wearing clean gloves to prevent contamination of the Prepreg surface; Be careful during operation to prevent Prepreg from wrinkling or

Wrinkles.

Precautions for using S1170G Prepreg: Prepreg is taken out of the cold storage and must undergo a reheating process before opening the packaging. The reheating time is more than 8 hours (depending on the specific storage conditions), and the packaging is opened when it is at the same ambient temperature; Prepreg that has already been sliced should be stored in either condition one or condition two environment and used up as soon as possible. If it exceeds 3 days, its indicators must be rechecked and deemed qualified before use; After opening the package of the coil shaped Prepreg, the remaining part of the coil shaped tail should be sealed to the original packaging level and stored in condition one or condition two;

If there is an IQC inspection plan, follow the IPC-4101 standard, Prepreg should be tested as soon as possible after receiving the goods (no more than 5 days); If pre wetting the sheet-like Prepreg before use, it is recommended to set the conditions for the dehumidification cabinet as follows: temperature<23 ℃, relative humidity around 40%, and upper limit of fluctuation not exceeding 50%.

S1170G PCB Processing Suggestions

Cutting: It is recommended to use a sawing machine for cutting, followed by a shearing machine. Pay attention to the possibility of edge delamination caused by roller cutting.

Core board baking: The S1170G core board can be baked according to actual usage conditions; If using baking after cutting, it is recommended to first wash the material with high-pressure water before baking to avoid introducing resin powder generated during the shearing process into the board surface, which may cause poor etching problems; Suggested drying conditions: 150 ℃/4~8h. Note that the plate shall not be in direct contact with the heat source.

Browning of the inner layer: Browning treatment is recommended for the inner core plate. In order to avoid excessive moisture absorption in the process and affecting the heat resistance of the plate, the core plate can be inserted for drying during browning (the effect of drying the plate by stacking the core plates together is not good). The recommended drying condition is 120 ℃/1 hour. The S1170G board can be laminated within 4 hours after drying.

Stacking: The S1170G stacking process ensures that the stacking sequence of the adhesive sheets is consistent, and avoids flipping during the stacking process to reduce the problem of warping and deformation caused by it.

Layering: It is recommended to heat up the circuit board at a rate of 1.5-3.0 ℃/min (within the material temperature range of 80-140 ℃) during lamination; The recommended high pressure for S1170G lamination is 350-420psi (approximately 25-30kgf/cm2), and the specific high pressure needs to be adjusted according to the structural characteristics of the board (Prepreg quantity and size of the filling area). It is recommended to switch to high pressure at 80-100 ℃; Curing conditions: temperature 180-190 ℃, time above 90 minutes; If insulation board or single panel is used in S1170G circuit board, it is necessary to roughen the insulation board or single panel before use to avoid the problem of insufficient bonding caused by the insulation board being too smooth, or to use double-sided board etched into single panel or insulation board for production.

Drilling: It is best to use a new drilling tool when drilling. It is recommended to stack one plate per stack (thick plate), and the hole limit should be appropriately reduced (300-1000) to ensure good hole wall quality. In addition, based on the ordinary FR-4 drilling parameters, it is recommended to reduce the falling speed by 10-20% appropriately to test the optimal drilling parameters.

Plate drying after drilling: It is recommended that the plate drying condition after drilling is 190 ℃/3h. Note that S1170G board cannot directly contact with heat source.

De drilling pollution: It is recommended to refer to lead-free high Tg materials and choose appropriate swelling and Desmear parameters for production. The specific parameters need to be set according to the actual PCB structure (board thickness, aperture size).

Solder mask ink: When using a bracket for baking, if the board is compressed or deformed during bracket insertion, warping problems may occur after baking; It is not recommended to perform solder mask ink backwash S1170G, as white spots may occur.

Tin spraying: S1170G is suitable for lead-free tin spraying process.

Appearance processing: It is recommended to use a milling machine for processing and reduce the travel speed appropriately. It is not recommended to use the blade method for processing S1170G.

Packaging: It is recommended to dry the S1170G before packaging under the condition of 140 ℃/4-6 h, so as to avoid the decline of heat resistance caused by moisture; It is recommended to use aluminum foil vacuum packaging for packaging materials.

Packaging expiration date: Aluminum foil vacuum packaging, with an expiration date of 3 months; It is best to bake the components at 125 ℃/4-8 hours before use.

Reflow soldering parameters: S1170G is suitable for conventional lead-free reflow soldering processing technology.

Suggestions for manual welding parameters: The welding temperature for S1170G should be between 350~380 ℃ (using a temperature controlled soldering iron); Welding time for a single solder joint: within 3 seconds.