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Special PCB

Aluminum nitride ceramic PCB

Special PCB

Aluminum nitride ceramic PCB

Aluminum nitride ceramic PCB

Model : Aluminum nitride ceramic PCB

Material : Ceramic PCB, Ceramic Substrate

Layer : 2Layer Ceramic PCB

Color : White

Thickness : Aluminum nitride 0.635mm

Copper Thickness : 1OZ(35um)

Surface Treatment : Immersion Gold

Gold thick : >=3U"

Minimum aperture : 0.8mm

Process features : through hole, ceramic dam technology


Product Details Data Sheet

Superior electrical and physical properties make ceramic substrate PCB more and more popular

The thermal conductivity is 20-200w / m.k (20-200 times of aluminum based copper substrate), and the dielectric withstand voltage is 17000v / mm (17 times higher than that of other circuit boards);

The surface roughness of ceramic board is 0.2-0.7um;

The compressive strength is more than 450MPa (higher than any PCB made of any material), and it has good electrical performance in various harsh environments (high temperature, high humidity, high pressure and high corrosion)

ceramic substrate PCB

ceramic substrate PCB

ipcb circuit company can process 3 mil / 3 mil precision circuit, 0.01-0.5 mm conductor thickness, micro hole filling, inorganic dam enclosure technology, 3D circuit, etc;

The thickness that ipcb circuit company can process: 0.25, 0.38, 0.5, 0.635, 1.0, 1.5, 2.0, 2.5, 3.0 mm, etc;

ipcb circuit company can process various surface treatments: gold plating process 1-30u, nickel palladium process 1-5u, silver plating process (3-30um), nickel plating process (3-10um), tin deposition process (1-3um).


Model : Aluminum nitride ceramic PCB

Material : Ceramic PCB, Ceramic Substrate

Layer : 2Layer Ceramic PCB

Color : White

Thickness : Aluminum nitride 0.635mm

Copper Thickness : 1OZ(35um)

Surface Treatment : Immersion Gold

Gold thick : >=3U"

Minimum aperture : 0.8mm

Process features : through hole, ceramic dam technology



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