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PCB Tech

Battery circuit board manufacturers' wiring requirements for circuit boards
2021-08-29
View:45
Author:Belle

1. Conventional signal line width and line spacing requirements
Taking into account the processing capacity of the battery circuit board factory, in the design of the circuit board with four layers or less, the line width and line spacing are required to be ≥5mil; in the six-layer and eight-layer circuit board design, the line width and line spacing are required to be ≥4mil. The line width design of the high current lead is the same as the power line.

 

Battery circuit board manufacturers' wiring requirements for circuit boards

2. Power line width and line spacing requirements
1. The line width requirement of VBATT electric line
The trace width requirements from the input end of the battery connector to the power end of the PA are as follows:
When the wire length is less than 60mm, the wire width is required to be ≥1.5mm;
When the trace length is greater than 60mm and less than 90mm, the line width is required to be ≥2mm.
To ensure the normal operation of the PA, the total length of the power lead from the battery connector to the PA should not be greater than 90mm.
2. The line width requirements of the remaining power leads
Depending on the current, the width of different power lines (working current less than 500mA) is generally set between 0.2mm-0.4mm.
 3. reduce the trace spacing requirements for crosstalk between traces
If crosstalk is easy to occur between two traces, the distance between the two traces should be ≥2W width, where W is the width of the trace, and avoid direct overlap between the upper and lower layers (for example, there is no ground layer isolation).

Battery circuit board manufacturers' wiring requirements for circuit boards

4. improve the high-frequency characteristics of the trace
In order to improve the high-frequency characteristics of high-speed signal wiring, the wiring should adopt a natural R-angle turning method. If it cannot be fully realized, a 135-degree turning method should be adopted, and the use of right-angle or sharp turning wiring should be avoided;
The device grounding PIN should be directly connected to the ground. If necessary, the nearest grounding method should be adopted, but the width of the trace should be ≥0.5mm, and the use of long wire grounding should be avoided.
5.the wiring of large devices
In order to ensure the anti-stripping characteristics of large devices, such as tantalum capacitors and battery connectors, the lead wires connected to the pads of these devices can be added with teardrops or copper attached, and more vias connected to other layers should be added.
 
6.the distance between the trace and the edge of the board
The distance between the trace and the edge of the board should be designed to be more than 0.25mm.