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HDI pcb board
2021-08-30
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Author:Belle

HDI board market supply and demand analysis The continuous growth of mobile phone production is driving the demand for HDI boards
The production capacity of domestic HDI boards cannot meet the rapidly growing demand
Introduction to HDI
Name source
HDI application
HDI board market supply and demand analysis The continuous growth of mobile phone production is driving the demand for HDI boards
The production capacity of domestic HDI boards cannot meet the rapidly growing demand


Introduction to HDI
   HDI is the abbreviation of High Density Inverter. It is a kind of (technology) for the production of printed boards. It is a circuit board with a relatively high line distribution density using micro-blind and buried via technology. HDI is a compact product designed for small-capacity users. It adopts a modular design that can be connected in parallel. One module has a capacity of 1000VA (1U height) and is naturally cooled. It can be directly placed in a 19" rack, and a maximum of 6 modules can be connected in parallel. The product adopts all-digital signal process control (DSP) technology and multiple This patented technology has a full range of adaptable load capacity and strong short-term overload capacity, regardless of load power factor and crest factor.


]Name source
  Printed circuit board is a structural element formed by insulating material supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic parts will be installed on it. Through the wire connection, the electronic signal connection and the application function can be formed. Therefore, the printed circuit board is a platform to provide component connection, which is used to accept the base of the connected parts.


As the PCB printed circuit board is not a general terminal product, the definition of the name is slightly confusing. For example, the motherboard for personal computers is called the motherboard and cannot be directly called the circuit board. Although there are circuit boards in the motherboard, They are not the same, so when evaluating the industry, the two are related but cannot be said to be the same. Another example: because there are integrated circuit parts mounted on the circuit board, the news media call it an IC board, but in fact it is not the same as a printed circuit board.


Under the precondition that electronic products tend to be multi-functional and complex, the contact distance of integrated circuit components has been reduced, and the speed of signal transmission has been relatively increased. This is followed by an increase in the number of wiring and the length of wiring between points. Local shortening requires the application of high-density circuit configuration and microvia technology to achieve the goal. Wiring and jumper are basically difficult to achieve for single and double panels. Therefore, the circuit board will be multi-layered, and due to the continuous increase of signal lines, more power and ground layers are necessary means for design. All of these have made the Multilayer Printed Circuit Board (Multilayer Printed Circuit Board) more common.


  For the electrical requirements of high-speed signals, the circuit board must provide impedance control with alternating current characteristics, high-frequency transmission capabilities, and reduce unnecessary radiation (EMI). With the structure of Stripline and Microstrip, multi-layer design becomes a necessary design. In order to reduce the quality problems of signal transmission, insulating materials with low dielectric coefficient and low attenuation rate are used. To cope with the miniaturization and arraying of electronic components, the density of circuit boards is continuously increased to meet demand. The emergence of component assembly methods such as BGA (Ball Grid Array), CSP (Chip Scale Package), DCA (Direct Chip Attachment), etc., has promoted printed circuit boards to an unprecedented high-density state.
Holes with a diameter of less than 150um are called microvias in the industry. Circuits made using the geometric structure of this microvia technology can improve the efficiency of assembly, space utilization, etc., as well as the miniaturization of electronic products. Its necessity.

HDI pcb board


  For circuit board products of this kind of structure, the industry has had many different names to call such circuit boards. For example, European and American companies used to use sequential construction methods for their programs, so they called this type of product SBU (Sequence Build Up Process), which is generally translated as "Sequence Build Up Process." As for the Japanese industry, because the pore structure produced by this type of product is much smaller than that of the previous hole, the production technology of this type of product is called MVP (Micro Via Process), which is generally translated as "Micro Via Process." Some people call this type of circuit board BUM (Build Up Multilayer Board) because the traditional multi-layer board is called MLB (Multilayer Board), which is generally translated as "build-up multilayer board".


   In order to avoid confusion, the IPC Circuit Board Association of the United States proposed to call this type of product the generic name of HDI (High Density Intrerconnection Technology). If it is directly translated, it will become a high-density connection technology. However, this cannot reflect the characteristics of the circuit board, so most circuit board manufacturers call this type of product HDI board or the full Chinese name "High Density Interconnection Technology". But because of the problem of the smoothness of spoken language, some people directly call this type of product "high-density circuit board" or HDI board.


 HDI application
  Electronic design is constantly improving the performance of the whole machine, while also working hard to reduce its size. In small portable products ranging from mobile phones to smart weapons, "small" is an eternal pursuit. High-density integration (HDI) technology can make terminal product designs more compact, while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camcorder) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured by build-up. The more build-up times, the higher the technical grade of the board. Ordinary HDI boards are basically one-time build-up. High-end HDI uses two or more build-up techniques, while using advanced PCB technologies such as stacking holes, electroplating and filling holes, and laser direct drilling. High-end HDI boards are mainly used in 3G mobile phones, advanced digital cameras, IC carrier boards, etc.


Development prospects: According to the use of high-end HDI boards-3G boards or IC carrier boards, its future growth is very rapid: the world's 3G mobile phones will increase by more than 30% in the next few years, and China will soon issue 3G licenses; IC carrier board industry consultation The organization Prismark predicts that China's predicted growth rate from 2005 to 2010 is 80%, which represents the direction of PCB technology development.
[Edit this paragraph] HDI board market supply and demand analysis
  
The continuous growth of mobile phone production is driving the demand for HDI boards
   China plays an important role in the world's mobile phone manufacturing industry. Since Motorola fully adopted HDI boards to manufacture mobile phones in 2002, more than 90% of mobile phone motherboards currently use HDI boards. A research report released by market research company In-Stat in 2006 predicted that in the next five years, global mobile phone production will continue to grow at a rate of about 15%. By 2011, global mobile phone sales will reach 2 billion units.
  
The production capacity of domestic HDI boards cannot meet the rapidly growing demand
In recent years, the current situation of global HDI mobile phone board production has undergone major changes: the major European and American PCB manufacturers, except for the well-known mobile phone board manufacturers ASPOCOM and AT&S, which still supply second-order HDI mobile phone boards for Nokia, most of the HDI production capacity has been transferred from Europe to Europe. Asian transfer. Asia, especially China, has become the world's main supplier of HDI boards. According to Prismark's statistics, in 2006, China's mobile phone production accounted for about 35% of the world's total. It is estimated that by 2009, China's mobile phone production will reach 50% of the world's total, and the purchase of HDI mobile phone boards will reach 12.5 billion yuan. From the perspective of major manufacturers, the current production capacity of major domestic manufacturers is less than 2% of total global demand. Although some manufacturers have made investments to expand production, on the whole, the domestic HDI capacity growth still cannot meet the rapidly growing demand.