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PCB Tech

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PCB Tech

PCB Tech

How can the printed circuit board control the quality of the electroplated copper layer
2021-09-03
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Author:Belle

The quality control of the electroplated copper layer of the through-hole PCB printed circuit board is very important, because the development of the multi-layer or laminated board to the direction of high density, high precision, and multi-function, the bonding force, uniformity and fineness, resistance of the copper plating layer Tensile strength and elongation

requirements are becoming stricter and higher, so the quality control of the electroplating of through-hole PCB printed circuit boards is particularly important. ipcb is a company dedicated to proofing and mass production of pcb board manufacturers, with high-precision single-sided/double-sided/multilayer circuit boards (1-26 layers), thermoelectric separation copper

 through-hole PCB printed circuit board

substrates, multilayer industrial control circuit boards, power supply pcb boards, medical circuits Boards, security PCB boards, communication PC boards, automotive circuit boards, instrumentation circuit boards, military circuit boards, composite busbar copper substrates, foldable metal substrates, FPC flexible and rigid boards, etc., quality assurance, delivery on time, sales As an integrated high-tech enterprise.

   To ensure the uniformity and consistency of the copper electroplating layer of the through-hole PCB printed circuit board, in the high aspect ratio printed circuit board copper electroplating process, most of them are assisted by high-quality additives, with appropriate air stirring and cathode movement, Under the condition of relatively low current density,

the electrode reaction control area in the hole is enlarged, and the effect of the electroplating additive can be displayed.


 In addition, the movement of the cathode is very conducive to the improvement of the deep plating ability of the plating solution. The degree of polarization is increased, and the formation speed of crystal nuclei and the growth speed of crystal grains in the electrocrystallization process of the coating compensate each other, so as to obtain a high-toughness copper layer.


Of course, the current density setting is based on the actual plating area of the printed circuit board to be plated. From the analysis of the original understanding of electroplating, the value of the current density must also be based on factors such as the main salt concentration of the high-acid low-copper electrolyte, the temperature of the solution, the content of additives, and the degree of stirring. In short, it is necessary to strictly control the process parameters and process conditions of copper electroplating to ensure that the thickness of the copper plating layer in the hole meets the technical standards.