PCB Tech - Causes of PCB delamination and countermeasures

Causes of PCB delamination and countermeasures

In the last article, we also talked about that when making PCB boards, we usually encounter some problems, most of which are the delamination problem of the circuit board. Today, we will only talk about the PCB board splitting from the delamination of the PCB circuit board. And provide some countermeasures for your reference.

After the PCB circuit board absorbs heat, different materials can produce different expansion coefficients, thereby forming corresponding internal stress, and when the resin and resin, the adhesion of the resin and the copper foil is not enough to resist this internal stress. Delamination, this is the root cause of PCB circuit board delamination, and after lead-free, the temperature and time of assembly are prolonged, it is more likely to cause PCB circuit board delamination.

As for how to deal with PCB delamination, we recommend the following methods:

1. The choice of base material should be as far as possible to select qualified materials with credibility, and the quality of the PP material of the multilayer board is also a key parameter.
2. The lamination process is controlled in place, especially for multilayer boards with thick inner copper foils, and more attention should be paid. Under thermal shock, PCB circuit board delamination occurred in the inner layer of the multilayer board, causing the entire batch to be scrapped.
3. Quality of sinking copper. The denser the copper layer on the inner wall of the hole, the thicker the copper layer, the stronger the thermal shock of the PCB circuit board. Both PCB circuit boards have high reliability and low manufacturing cost, and each step of the electroplating process control requires refined control.

The reason for PCB delamination fundamentally prevents PCB circuit board delamination, which is what every excellent PCB manufacturer should learn.

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