PCB Tech - Flexible circuit board production process and advantages and disadvantages

Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good flexibility. They are widely used in mobile phones, computers and LCD screens, CD players, disk drives, and the latest applications. Today, the editor mainly introduces the production process and advantages and disadvantages of flexible circuit boards. I hope it can help everyone.

Flexible circuit board production process

Double panel production process

Cutting-Drilling-PTH-Plating-Pretreatment-Applying dry film-Aligning-Exposure-Developing-Graphic plating-Removing film-Pretreatment -Paste the cover film-Pressing-Curing-Immersion of nickel gold-Printing characters-Cutting-Electrical measurement-Punching-final inspection-Packing-shipping

Single panel production process

Cutting - drilling - sticking dry film - alignment - exposure - developing - etching - stripping - surface treatment - covering film - pressing - curing - surface treatment - immersion of nickel and gold - printing characters - cutting - electrical measurement - punching Cutting-final inspection-packaging-shipping

Advantages and disadvantages of flexible circuit boards

The advantages of multi-layer circuit boards: high assembly density, small size, light weight, because of high-density assembly, the connection between components (including parts) is reduced, thereby increasing reliability; it can increase the wiring layer, and then increase the design flexibility; It can also form the impedance of the circuit, can form a certain high-speed transmission circuit, can set the circuit, electromagnetic shielding layer, and can also install a metal core layer to meet the functions and requirements of special thermal insulation, etc.; easy installation and high reliability.

Disadvantages of multi-layer PCB boards (unqualified): high cost, long cycle; high reliability inspection methods are required. Multilayer printed circuit is the product of electronic technology, multi-function, high speed, small volume and large capacity. With the development of electronic technology, especially the wide application of large-scale and ultra-large-scale integrated circuits, the rapid, high-precision, high-number change directions of the multilayer printed circuit with higher density appear fine lines.