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PCB Tech

What are the manufacturing processes for double-sided PCB circuit boards?
2021-09-12
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Author:Aure

What are the manufacturing processes for double-sided PCB circuit boards?

The double-sided board is a PCB circuit board that is used more frequently, and its manufacturing process is more complicated. So, what are the manufacturing processes of double-sided PCB circuit boards?


1. Graphic plating process:

        Foil Clad Laminate --> Blanking --> Punching and Drilling Benchmark Holes --> CNC Drilling --> Inspection --> Deburring --> Electroless Plating of Thin Copper --> Electroplating of Thin Copper --> Inspection --> Brushing --> Filming (or screen printing) --> Exposure and development (or curing) --> Inspection and repairing --> Graphic plating --> Film removal --> Etching --> Inspection and repairing --> Plug Nickel plating and gold plating --> Hot melt cleaning --> Electrical continuity inspection --> Cleaning treatment --> Screen printing solder mask pattern --> Curing --> Screen printing marking symbols --> Curing --> Shape processing- -> Washing and drying --> Inspection --> Packaging --> Finished product.
Note: The two processes of "electroless plating of thin copper --> electroplating of thin copper" can be replaced by the "electroless plating of thick copper" process, both of which have their own advantages and disadvantages.


What are the manufacturing processes for double-sided PCB circuit boards?


2 SMOBC process:

        The main advantage of the bare copper-clad solder mask process (SMOBC) is that it solves the short-circuit phenomenon of solder bridging between thin lines. At the same time, due to the constant ratio of lead to tin, it has better solderability and storage properties than hot melt boards. The basis of the SMOBC process is to first make a bare copper hole metallized double-sided board, and then apply hot air to level it.


There are many methods for manufacturing SMOBC boards. The following mainly introduces the pattern plating method and the lead-tin removal process and the hole plugging process:


(1) The pattern electroplating method and then the lead-tin removal process is similar to the pattern electroplating process, and only changes after etching: double-sided copper clad board --> According to the pattern electroplating process to the etching process --> lead-tin removal - > Inspection --> Cleaning --> Solder Mask Pattern --> Nickel-plated and Gold-plated Plugs --> Plug Tape --> Hot Air Leveling --> Cleaning --> Screen Printing Marking Symbols --> Shape Processing --> Washing and drying --> Finished product inspection --> Packaging --> Finished product.


(2) Hole plugging process: double-sided foil-clad board --> drilling --> electroless copper plating --> whole board copper electroplating --> plugging holes --> screen printing imaging (positive image) --> etching --> To remove the screen printing material, remove the hole blocking material --> Cleaning --> Solder mask pattern --> Nickel-plated, gold-plated plug --> Tape on the plug --> Hot air leveling --> The following procedures are the same as above To the finished product.


Note: The process steps of this process are relatively simple, and the key is to plug the holes and clean the ink that plugs the holes.


The above is the double-sided PCB circuit board manufacturing process detailed by professional PCB engineers. Have you mastered it?