PCB Tech - PCB heat dissipation is so important, what techniques can be made lighter?

The electrical energy consumed by electronic equipment during operation, such as RF power amplifiers, FPGA chips, and power products, in addition to useful work, most of which is converted into heat and emitted
1. The importance of thermal design
The electrical energy consumed by electronic equipment during operation, such as radio frequency power amplifiers, FPGA chips, and power products, in addition to useful work, most of which is converted into heat and dissipated. The heat generated by the electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliability of the electronic equipment will decrease. SMT increases the installation density of electronic equipment, reduces the effective heat dissipation area, and the temperature rise of the equipment seriously affects the reliability. Therefore, the research on thermal design is very important.
Brothers engaged in radio frequency have firewood, so heat dissipation is fine?
The heat dissipation of the PCB circuit board is a very important link, so what is the heat dissipation technique of the PCB circuit board, let's discuss it together.
For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the device will fail due to overheating. The reliability of the electronic equipment Performance will decrease. Therefore, it is very important to conduct a good heat dissipation treatment on the circuit board.

Second, the analysis of the temperature rise factors of the printed circuit board
The direct cause of the temperature rise of the printed board is due to the existence of circuit power consumption devices. Electronic devices all have power consumption to varying degrees, and the heating intensity varies with the size of the power consumption.
Two phenomena of temperature rise in printed boards:
(1) Local temperature rise or large area temperature rise;
(2) Short-term temperature rise or long-term temperature rise. When analyzing PCB thermal power consumption, it is generally analyzed from the following aspects.
2.1 Electrical power consumption
(1) Analyze the power consumption per unit area;
(2) Analyze the distribution of power consumption on the PCB.
2.2 The structure of the printed board
(1) The size of the printed board;
(2) The material of the printed board.
2.3 How to install the printed board
(1) Installation method (such as vertical installation, horizontal installation);
(2) The sealing condition and the distance from the casing.
2.4 Thermal radiation
(1) The emissivity of the printed board surface;
(2) The temperature difference between the printed board and the adjacent surface and their absolute temperature
2.5 Heat conduction
(1) Install the radiator;
(2) Conduction of other installation structural parts.
2.6 Thermal convection
(1) Natural convection;
(2) Forced cooling convection.
The analysis of the above factors from the PCB is an effective way to solve the temperature rise of the printed board. These factors are often related and dependent on each other in a product and system. Most of the factors should be analyzed according to the actual situation, and only for a specific The actual situation can calculate or estimate the parameters such as temperature rise and power consumption more correctly.