PCB Tech - Laser technology applied to the production of multilayer printed circuit boards

Laser technology applied to the production of multilayer printed circuit boards

Laser technology is used in the production of multilayer printed circuit boards: laser processing technology uses the special nature of the interaction between laser columns and things to cut, weld, surface treatment, perforate, and micro-process materials (including metals and non-metals) And as a light source, distinguishing objects, etc., the largest field of traditional application is laser processing technology.

Laser technology is a comprehensive technology that involves multiple disciplines such as light, mechanics, electricity, material inspection and measurement. Traditionally, its research scope can generally be divided into:

1. Laser processing system. Covers lasers, light guide systems, processing machine tools, control systems and inspection and measurement systems.

2. Laser processing technology. It covers cutting, welding, surface treatment, punching, marking, scribing, fine-tuning and other processing techniques.

Laser welding
Thick and thin plates of vehicle body, vehicle parts, lithium batteries, cardiac pacemakers, tightly sealed closed relays and other tightly sealed components, as well as various components that are not allowed to be welded, contaminated and deformed. The lasers used so far include YAG lasers, CO2 lasers and semiconductor pump lasers.

Laser cutting

Transportation tool industry, computer, electrical casing, wooden knife mold industry, cutting and cutting of various metal parts and special materials, circular saw blades, acrylic, spring washers, copper plates for electronic parts under 2mm, and one-point metal mesh Plates, steel pipes, tinplates, lead-plated steel plates, phosphor bronzes, bakelites, thin aluminum alloys, quartz glass, silicon rubber, ceramic ceramic slabs of oxygenated aluminum below 1mm, chromium alloys used in the aerospace industry, etc. The lasers used are YAG lasers and CO2 lasers.

Laser Marking
It has been widely used in various materials and almost all industries. The lasers used so far include YAG lasers, CO2 lasers and semiconductor pump lasers.

Laser drilling
Laser drilling is mainly used in aerospace, transportation, electronic instrumentation, chemical industry and other industries. The rapid progress of laser drilling is mainly manifested in that the uniform output power of the YAG laser used for drilling has increased from 400w at the beginning of 5 years to 800w to 1000w. The relatively mature application of laser drilling in China so far is in the production of artificial diamonds and naturally occurring diamond wire drawing dies, and the production of jewelry bearings for instruments, aircraft blades, multilayer printed circuit boards and other industries. The lasers used so far are mostly YAG lasers and CO2 lasers, as well as excimer lasers, isotope lasers and semiconductor pump lasers.

Laser heat treatment
It is widely used in the transportation industry, such as the heat treatment of cylinder liners, crankshafts, piston rings, commutators, gears and other components. It is also widely used in aerospace, machine tool industry and other machinery industries. Laser heat treatment in my country should be used far more widely than overseas. The lasers used so far are mostly YAG lasers and CO2 lasers.

Laser rapid completion type
It is formed by combining laser processing technology with computer digital control technology and flexible manufacturing technology. It is mostly used in the production of model and board type industries. The lasers used so far are mostly YAG lasers and CO2 lasers.

Laser coating
It is widely used in aerospace, production model and electromechanical industries. The lasers used so far are mostly high-power YAG lasers and CO2 lasers.

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