Ultra-precision PCB Fabrication, High Frequency PCB, High Speed PCB, IC Substrate, Multilayer PCB and PCB Assembly.
The most reliable PCB custom service factory.
PCB Tech

PCB Tech

PCB Tech

PCB Tech

Thermal considerations in PCB design
2021-09-22
View:38
Author:Frank

Thermal considerations in PCB design
In ordinary digital circuit design, we rarely consider the heat dissipation of integrated circuits, because the power consumption of low-speed chips is generally very small, and under normal natural heat dissipation conditions, the temperature rise of the chip will not be too large. With the continuous improvement of chip speed, the power consumption of a single chip has gradually increased. For example, the power consumption of Intel's Pentium CPU can reach 25W. When the natural conditions of heat dissipation can no longer control the temperature rise of the chip below the required index, it is necessary to use appropriate heat dissipation measures to accelerate the release of heat on the chip surface, and make the chip work within the normal temperature range.

pcb board

Under normal conditions, the transfer of heat includes three ways: conduction, convection and radiation. Conduction refers to the transfer of heat between directly contacting objects from the higher temperature to the lower temperature. Convection transfers heat through the flow of fluid, while radiation does not require any media. The heating element directly releases heat to the surrounding space. .
In practical applications, there are two ways to dissipate heat, radiator and fan, or the use of both at the same time. The radiator conducts the heat of the chip to the radiator through close contact with the surface of the chip. The radiator is usually a good heat conductor with many blades. Its fully expanded surface greatly increases the heat radiation and at the same time circulates air. It can also take away more heat. The use of fans is also divided into two forms, one is directly installed on the surface of the radiator, and the other is installed on the chassis and rack to increase the air flow rate in the entire space. Similar to the most basic Ohm's law in circuit calculations, there is a most basic formula for heat dissipation calculations:
Temperature difference = thermal resistance × power consumption.
iPCB is happy to be your business partner. Our business goal is to become the most professional prototyping PCB manufacturer in the world. With more than ten years of experience in this field, we are committed to meeting the needs of customers from different industries in terms of quality, delivery, cost-effectiveness and any other demanding requirements. As one of the most experienced PCB manufacturers and SMT assemblers in China, we are proud to be your best business partner and good friend in all aspects of your PCB needs. We strive to make your research and development work easy and worry-free.
quality assurance
iPCB has passed ISO9001:2008, ISO14001, UL, CQC and other quality management system certifications, produces standardized and qualified PCB products, masters complex process technology, and uses professional equipment such as AOI and Flying Probe to control production and X-ray inspection machines. Finally, we will use double FQC inspection of appearance to ensure shipment under IPC II standard or IPC III standard.