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PCB Tech

PCB Tech

PCB Tech

PCB Tech

PCB plating knowledge
2021-09-23
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Author:Aure

PCB plating knowledge


1. What are the main ingredients in the electric copper cylinder? What is the role, and what is the specific reaction principle?

Main components: copper sulfate 60--90 g/liter main salt, providing copper source sulfuric acid 8--12% 160---220 g/liter plating solution conductive, dissolving copper salt, plating depth capacity; chloride ion 30- -90ppm auxiliary light agent; copper light agent 3--7ml.

2. What is the current density when the board is fully powered? Why do some double-clip sticks and what's the function? And how do you use the diverter, and under what circumstances should you use the diverter?

The current density is generally 1.5-2.5 amperes/square decimeter; the double clip rod can ensure the uniformity of the current distribution on the plate; the shunt strip is used on the part of the cathode conductive rod near the sides of the cylinder on both sides to prevent the plate caused by the edge effect of the electric field. A phenomenon in which the thickness of the edge or edge plate is too thick.



PCB plating knowledge


3. What is the difference between single-clamp and double-clamp during line plating? Under what specific circumstances do you want to do this!

The reason is the same as above, the double-clamping rod is beneficial to increase the thickness distribution of the plate surface coating.

4. What are the requirements for the splint method when the circuit is electroplated, and what is the distance between the board and the board? What is the result if the spacing is too large? What is the result of stacking boards? How to arrange the boards with independent holes or independent lines?

Clamping and close contact, the area difference between the two sides is relatively small; staggered transposition can be used; the spacing between the plates is as close as possible, and the plates are not stacked; the distance is too large, and the thickness of the plating layer on the edge of the plate is unevenly distributed; independent lines/holes are in the Add an auxiliary grid design to the design or use a low current to extend the time appropriately to ensure the uniformity of the coating and prevent the film and the lines from being too thick.

5. What is the basis for determining the current density during circuit electroplating? What density should be used in what kind of situation? (Current indication)

According to the actual area of the plate that needs to be plated, not the area of the plate; there are three types of current 1.5---2.5; depending on the type of plating solution, the thickness of the plate, the size of the aperture, the distribution of the pattern on the plate, and so on.

6. What is the relationship between plating time and copper thickness?

Linear relationship; plating thickness in microns = = plating time minutes x current density ampere / square decimeter x 0.217 micron / ampere minute.

7. A term that I often hear: What does it mean to have one plated with two plates?

The copper thickness of the current total board is called ampere; it is a bit confusing; each company says that the law is not one ampere = 1 ampere / square decimeter; ampere = ounce / square foot = 35 microns of copper thickness, which refers to the copper thickness of the substrate.

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