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PCB Tech - Testing methods and standards for flexible circuit boards in flexible circuit board factories​

PCB Tech

PCB Tech - Testing methods and standards for flexible circuit boards in flexible circuit board factories​

Testing methods and standards for flexible circuit boards in flexible circuit board factories​

2021-09-25
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Author:Kavie

The flexible circuit board of the flexible circuit board factory includes flexible circuit single-sided, double-sided and multi-layer boards. The soft board mentioned in this standard refers to single, double and multilayer flexible copper foil substrates with polyimide (PI) or polyester (PET) as the base material, including those with glue and without glue Flexible copper foil substrate.


FPC

The purpose of the test of the flexible circuit board of the flexible circuit board factory is to establish a general rule for the appearance and quality of the flexible circuit board. The basis for the judgement of the appearance quality of the flexible circuit board product is allowed to be rejected, which helps to improve the manufacturing technology and reduce unnecessary scrap caused by Waste of resources and environmental pollution. Test method The test method uses visual inspection, magnifying glass, and ruler as the main inspection methods and tools. If necessary, other applicable test instruments or equipment may be used for inspection.


Flexible circuit board factory

Basic testing standards:

1. The appearance of the substrate film surface;

2. The appearance of the covering layer;

3. Deviation of connecting plate and covering layer;

4. The seepage of adhesive and cover coating;

5. The conductor under the covering layer changes color. After 96 hours of humidity resistance test at a temperature of 40°C, a humidity of 90%, it must still meet the requirements of voltage resistance, bending resistance, bending resistance, and welding resistance;

6. Missing coating of the coating layer;

7. Poor electroplating combination.


Precautions:

Description of the shelf life of the flexible circuit board(hereinafter referred to as FPC) of the flexible circuit board factory:

The conductor part of FPC needs to be treated with surface plating (anti-rust), such as plating, gold plating, OSP, tin plating, etc. The storage environment should avoid corrosive gases, and the temperature should be controlled at 20 /-5 degrees Celsius, and the relative humidity should be controlled within the range of 70% R.H. Under the above storage conditions, the effective shelf life of the product is 6 months after leaving the factory.