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PCB Tech

PCB Tech

PCB Tech

PCB Tech

Double-sided circuit board production process

1. Introduction to the overall process

Customer requirements→engineering design materials→manufacturing work order MI→cutting/baking plate→drilling→copper plating/plate surface plating→brushing→circuit board→copper tin plating→filming/etching→tinning→solder mask→nickel sinking Gold→forming/stamping→finished test→high temperature leveling→finished product inspection→finished product warehouse

 2. Process description

  1) Cutting: Cut out the size that is convenient for processing from the whole piece of copper clad laminate with a certain thickness and copper foil thickness

  2) Drilling: Drill conductive holes or plug-in holes on the board according to the computer drilling program

3) Copper sinking: deposit a thin layer of chemical copper in the drilled hole, the purpose is to deposit a layer of copper on the non-conductive epoxy glass cloth substrate (or other substrates) by chemical methods to facilitate subsequent electroplating Conduction to form a circuit;

  4) Copper plating on the whole board: mainly to thicken and protect the thin chemical copper to prevent it from oxidizing in the air, forming no copper or holes in the hole;

  5) Circuit (graphic transfer): Paste a dry film or silk screen on the board with a graphic anti-plating ink, after exposure and development, the circuit pattern is made

  6) Pattern electroplating: thicken the copper plating of the circuit on the board with the pattern circuit, so that the thickness of the copper in the hole and the circuit board reaches a certain thickness, which can load a certain current

  7) Etching: remove the graphic ink or dry film, and etch away the excess copper foil to obtain the conductive circuit board pattern

     8) Strip tin: Strip the tin layer on the formed pattern to expose the required circuit board

       9) Screen printing solder mask ink or paste solder mask dry film: Print a layer of solder mask ink on the board, or paste a layer of solder mask dry film, after exposure and development, make a solder mask pattern, the main purpose is to prevent welding When a short circuit occurs between the lines

  10) Gold/Spray tin: Immerse gold or spray a layer of tin on the place on the board that needs to be soldered, which is convenient for soldering and can also prevent oxidation of the copper surface at the place

  11) Characters: Some iconic characters are printed on the board, which is mainly convenient for customers to install components

  12) Stamping/forming: process the shape of the board according to customer requirements

  13) Electrical test: detect whether there is an open or short circuit in the PCB by means of a closed loop

  14) FQC/Packaging: Shipment by inspection board

circuit board