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In-depth analysis of the circuit board surface treatment process, the difference and application of immersion gold and gold plating
2021-09-29
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Author:farnk

In-depth analysis of the circuit board surface treatment process, the difference and application of immersion gold and gold plating
The whole plate gold plating we refer to generally refers to "electroplating gold", "electroplating nickel gold plate", "electrolytic gold", "electric gold" and "electric nickel gold plate". There is a distinction between soft gold and hard gold. Generally, hard gold is Used for gold fingers.


  The principle is to dissolve nickel and gold (commonly known as gold salt) in chemical water, immerse the circuit board in the electroplating tank and turn on the current to form a nickel-gold plating layer on the copper foil surface of the circuit board.


  Electric nickel gold is widely used in electronic products because of its high hardness, wear resistance and non-oxidation.


  Immersion gold is a method of chemical oxidation-reduction reaction to generate a layer of plating, generally thicker, it is a kind of chemical nickel-gold layer deposition method, which can reach a thicker gold layer.

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   1. Generally, the thickness of gold is much thicker than gold plating. Immersion gold will be golden yellow and yellower than gold plating. Customers are more satisfied with the surface of the gold. The crystal structure formed by the two is different.

   2. Because the crystal structure formed by immersion gold and gold plating is different, immersion gold is easier to weld than gold plating, and will not cause poor welding and cause customer complaints. At the same time, it is precisely because sinking gold is softer than gold plating, so gold finger circuit boards generally choose gold plating, hard gold is wear-resistant.


  3. The immersion gold board only has nickel and gold on the pads. In the skin effect, the signal transmission is on the copper layer and will not affect the signal.


   4. Immersion gold has a denser crystal structure than gold plating, and it is not easy to produce oxidation.


   5. With the denser wiring, the line width and spacing have reached 3-4MIL. Gold plating is prone to short circuit of gold wire. The immersion gold board only has nickel gold on the pad, so it will not produce gold wire short circuit.

   6. Immersion gold circuit boards only have nickel and gold on the pads, so the solder mask on the circuit and the copper layer are more firmly bonded. The project will not affect the spacing during compensation.

  7. Generally used for relatively high-demand boards, the flatness is better, and generally use immersion gold, and immersion gold generally does not appear black pad phenomenon after assembly. The flatness and stand-by life of the immersion gold board are as good as the gold-plated board.
   8. Now the price of gold on the market is expensive. In order to save costs, many manufacturers are no longer willing to produce gold-plated plates, and only make immersion gold plates with nickel-gold on the pads. The price is indeed much cheaper.
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