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What are the desoldering techniques for SMT processing in the smt factory?
2021-10-03
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Author:Frank

What are the desoldering techniques for SMT processing in the smt factory?
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What are the desoldering techniques for SMT processing in the smt factory? Generally speaking, it is not so easy to remove smt patch processing components. Constant practice is required to be proficient, otherwise, it is easy to damage the smt components if it is forcibly disassembled. Of course, the mastery of these skills requires practice. The following are the following smt factories:

The desoldering techniques of smt factory patch processing are as follows:

  1. For smt chip processing components with few feet, such as resistors, capacitors, diodes, triodes, etc., first tin plating on one of the pads on the PCB board, and then use tweezers to hold the component with your left hand and place it in the mounting position and hold it against it. On the circuit board, use a soldering iron to solder the pins on the tinned pad with your right hand. The left-hand tweezers can be loosened, and solder the remaining feet with tin wire instead. If you want to disassemble this kind of component, it is easy, just use a soldering iron to heat both ends of the component at the same time, and then gently lift the component after the tin is melted.


  2. pcb board

2. For the components with more pins in the smt factory chip processing components, and the chip components with a wider spacing, a similar method is adopted. First, tin plate on one pad, and then use tweezers to clamp the component with your left hand. After soldering, use tin wire to solder the remaining feet. The disassembly of this type of component is generally better with a hot air gun. One hand holds the hot air gun to blow the solder, and the other hand uses tweezers and other fixtures to remove the component while the solder is melting.

3. For components with higher pin density, the soldering steps are similar, that is, solder one leg first, and then solder the remaining legs with tin wire. The number of pins is relatively large and dense, and the alignment of the pins and the pads is the key. Usually choose the soldering pads on the corners with only a small amount of tin plated. Use tweezers or hands to align the components with the soldering pads. Align the edges with pins. Press the components on the PCB with a little force and solder them with a soldering iron. The corresponding pins of the disk are soldered well.

Finally, it is recommended that the disassembly of high-pin-density components mainly use a hot air gun, clamp the components with tweezers, blow all the pins back and forth with the hot air gun, and lift the components when they are all melted. If there are more components to be removed, try not to face the center of the components when blowing, and the time should be as short as possible. After the components are removed, use a soldering iron to clean the pads.
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