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PCB Tech

PCB Tech

PCB Tech

PCB Tech

The development trend of PCB technology
2021-10-14
View:23
Author:Downs

With the rapid development of electronic technology, only by recognizing the development trend of PCB technology, circuit board manufacturers can actively develop and innovate production technology in order to find a way in the fiercely competitive PCB industry. As the world's largest producer of PCB boards, the production and processing capabilities of Shenzhen circuit board manufacturers will become a key part of the development of the electronics industry. Circuit board manufacturers must always maintain the awareness of development. The following are some views on the development of PCB production and processing technology:

1. Develop component embedding technology

Component embedding technology is a huge change in PCB functional integrated circuits. Semiconductor devices (called active components), electronic components (called passive components) or passive components are formed on the inner layer of PCB. "Component embedding PCB" has begun to be used. Production, but to develop circuit board manufacturers must first solve the analog design method, production technology and inspection quality, reliability assurance is also a top priority. PCB factories must increase resource investment in systems including design, equipment, testing, and simulation in order to maintain strong vitality.

pcb board

2. HDI technology is still the mainstream development direction

HDI technology promotes the development of mobile phones, drives the development of information processing and control basic frequency functions of LSI and CSP chips (packages), and the development of template substrates for circuit board packaging. It also promotes the development of PCBs. Therefore, circuit board manufacturers must innovate along the HDI road. PCB production and processing technology. As HDI embodies the most advanced technology of contemporary PCB, it brings fine wire and small aperture to PCB board. HDI multi-layer board application terminal electronic products-mobile phones (mobile phones) is a model of HDI cutting-edge development technology. In mobile phones, PCB motherboard micro-wires (50μm~75μm/50μm~75μm, wire width/spacing) have become the mainstream. In addition, the conductive layer and the thickness of the board are thinner; the conductive pattern is refined, which brings high-density and high-performance electronic equipment .

3. Continuously introduce advanced production equipment and update the circuit board manufacturing process

HDI manufacturing has matured and tends to be perfected. With the development of PCB technology, although the commonly used subtractive manufacturing methods in the past still dominate, low-cost processes such as additive and semi-additive methods have begun to emerge. Using nanotechnology to make holes metallized and simultaneously form PCB conductive patterns, a novel manufacturing process method for flexible boards. High-reliability, high-quality printing method, inkjet PCB process. Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Uniform plating equipment. Production component embedded (passive active component) manufacturing and installation equipment and facilities.

4. Develop higher performance PCB raw materials

Whether it is a rigid PCB circuit board or a flexible PCB circuit board material, with the global lead-free electronic products, it is required to make these materials have higher heat resistance, so the new type of high Tg, small thermal expansion coefficient, small dielectric constant, and dielectric loss Good materials for angle tangent continue to emerge.

5. Bright prospects for photoelectric PCB

The photoelectric PCB circuit board uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer that is formed by methods such as lithography, laser ablation, and reactive ion etching. At present, this technology has been industrialized in Japan and the United States. As a major production country, Chinese circuit board manufacturers should also actively respond and keep up with the pace of scientific and technological development.