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PCB Tech

PCB Tech

PCB Tech

PCB Tech

PCB appearance and functional test terms

1.1as received

The products submitted for acceptance have not been subjected to any condition treatment, and they are in the state of mechanical test under normal atmospheric conditions

1.2 production board

Any printed board in accordance with the design drawings, relevant specifications and procurement requirements, and produced in a production batch

1.3 test board

A printed board produced by the same process to determine the acceptability of a batch of printed boards. It can represent the quality of the batch

1.4 test pattern

It is used to complete a conductive pattern for testing. The pattern can be a part of the conductive pattern on the production board or a special designed test pattern. The test pattern can be placed on the attached test board and the liquid can be placed on a separate test board (coupon)

1.5 composite test pattern

A combination of two or more different test patterns, usually placed on a test board

1.6 quality conformance test circuit

A complete set of test patterns is included in the board to determine the acceptability of the quality of the printed board on the board

1.7 test coupon attached test board

A part of the diagram of a quality conformance inspection circuit used for a specified acceptance inspection or a set of related tests

1.8 storage life

2 appearance and size

2.1 visual examination

Examination of physical characteristics by naked eyes or at specified magnification

2.2 blister

It is a form of delamination, which is caused by local expansion between the layers of the substrate or between the substrate and the conductive foil, and between the substrate and the protective coating

2.3 blow hole

Holes due to venting

2.4 bulge

The phenomenon that the surface of printed circuit board or clad laminate is raised due to internal delamination or separation of fiber and resin

2.5 circular fracture

A kind of crack or cavity. It exists in the coating around the plating hole, or in the solder joint around the lead wire, or in the solder joint around the blind rivet, or at the interface between the solder joint and the connecting plate

2.6 cracking cracks

A breakage of a metallic or nonmetallic layer that may extend all the way to the bottom

2.7 crazing microcracks

The separation of glass fibers from resin at fabric interlacing. It is characterized by the appearance of white spots or cross lines under the surface of the substrate, usually related to mechanical stress

2.8measling leukoplakia

In the interior of the substrate, the separation of glass fiber and resin occurs at the interweaving part of the fabric. The appearance of dispersed white spots or cross patterns under the surface of the substrate is usually related to thermal stress

2.9 cracking of conformal coating

Fine network cracks on the surface and inside of the conformal coating

2.10 delamination layering

The phenomenon of interlayer separation between insulating substrate and conductive foil or multilayer board

2.11dent indentation

The surface of the conductive foil has no obvious reduction in the thickness of the smooth depression

2.12 residual copper of estraneus copper

Unwanted copper remaining on the substrate after chemical treatment

2.13 fiber exposure

The appearance of reinforced fibers in the substrate due to mechanical processing or abrasion or chemical erosion

2.14 weave exposure

A condition on the surface of a substrate in which the unbroken woven glass fibers are not completely covered with resin

2.15 weave texture

A condition on the surface of the substrate, that is, the fibers woven with glass cloth in the substrate are not broken and are completely covered by resin, but show the grouping pattern of glass cloth on the surface

2.16 wrinkle

A crease or wrinkle on the surface of a foil

17 haloing halo

Damage or delamination on or under the surface of a substrate caused by machining. It usually appears as a white area around the hole or other machined parts

2.18hole breakout

The phenomenon that the connecting plate does not completely surround the hole

2.19flare taper hole

In punching engineers, a tapered hole formed on the substrate of the exit face of the punch

2.20 splay inclined hole

Rotary drill bit out of eccentric, out of round or vertical hole

2.21 void void void

Lack of material in local areas

22 hole void

A hole in the substrate exposed in the metal coating of the plated hole

2.23inclusion inclusion

Foreign particles sandwiched in the substrate, wire layer, coating layer or solder joint

2.24lifted land connecting plate warping

The phenomenon that the connecting plate is warped or separated from the base material, regardless of whether the resin is warped with the connecting plate or not

2.25nail heading

The phenomenon of copper foil stretching along the hole wall of inner wire caused by drilling in multilayer board

2.26nick gap

27 nodule nodule

An irregular block or nodule protruding from the surface of a coating

2.28pin hole

A small hole that completely penetrates a layer of metal

2.30 resin shrinkage

The cavity between the plated hole wall and the hole wall can be seen from the micro section of the plated hole after high temperature

2.31scratch scratch

32 bump

Protuberances on the surface of conductive foil

2.33conductor thickness

The ring width of 2.34 minimum annual ring

2.35 registration coincidence degree

The consistency of the position of a pattern, hole or other feature on a printed circuit board with the specified position

2.36base material thickness

2.37 metal clad laminate thickness

2.38 resin preserved area

Due to insufficient resin, the part of the laminate can not fully infiltrate the reinforcement material. It shows poor gloss, and the surface is not completely covered by resin or exposed fiber

2.39 resin rich area

The area where there is no reinforcement on the laminate surface where the resin thickens significantly, i.e. the area where there is resin but no reinforcement

2.40 gelation particle

Solidified, usually translucent particles in a laminate

2.41 treatment transfer

The phenomenon that the treated layer (oxide) of copper foil is transferred to the substrate. After the copper foil is etched, the black, brown, or red traces remain on the surface of the substrate

2.42printed board thickness

The total thickness of the substrate and the conductive material (including coating) covered on the substrate

2.43 total board thickness

The thickness of printed circuit board includes electroplating layer, electroplated layer and other coating layer forming a whole with printed circuit board

2.44 perpendicularity

Angle of rectangular plate and offset of 90 degrees

3 electrical properties

3.1 contact resistance

The surface resistance at the contact interface measured under specified conditions

3.2 surface resistance

The quotient of the DC voltage between two electrodes on the same surface of the insulator divided by the steady-state surface current formed between the two electrodes

3.3 surface resistance

The quotient of the DC electric field strength on the surface of an insulator divided by the current density

3.4 volume resistance

The quotient of the DC voltage applied between two electrodes on the opposite surfaces of the specimen divided by the steady-state surface current formed between the two electrodes

3.5 volume resistance

The quotient of the DC electric field strength in the sample divided by the steady-state current density

3.6 dielectric constant

The ratio of capacitance obtained by filling dielectric between electrodes of specified shape to capacitance of the same electrode in vacuum

3.7 dielectric dispersion factor

When a sine wave voltage is applied to the dielectric, the residual angle of the phase angle between the current phasor leading through the dielectric and the voltage phasor is called the loss angle, and the tangent value of the loss angle is called the loss factor

3.8q factor quality factor

A quantity used to evaluate the electrical properties of a dielectric. Its value is equal to the reciprocal of the dielectric loss factor

3.9 dielectric strength

The voltage per unit thickness of insulating material before breakdown

3.10 dielectric breakdown

The phenomenon that insulating materials completely lose their insulating properties under the action of electric field

3.11 comparative tracking index

Under the combined action of electric field and electrolyte, the surface of insulating material can withstand 50 drops of electrolyte without forming electric trace

3.12arc resistance

The ability of an insulating material to withstand the action of an electric arc along its surface under specified test conditions. Usually, the time required for the arc to cause carbonization on the surface of the material to conduct electricity on the surface is usually used

3.13 dielectric withstanding voltage

The voltage that an insulator can withstand when the insulation is not damaged and there is no conduction current

3.14 surface corrosion test

Test to determine whether the etched conductive pattern has electrolytic corrosion under the condition of polarization voltage and high humidity

3.15 electrical corrosion test at edge

Test to determine whether the base material causes corrosion of metal parts in contact with it under polarization voltage and high humidity conditions

4 non electrical properties

4.1 bond strength

The force perpendicular to the board surface per unit area required to separate adjacent layers of printed board or laminate

4.2 pull off strength

The force required to separate the connecting plate from the substrate when a load or tension is applied axially

4.3 pullout strength

The force required to separate the metal layer of the plated hole from the substrate when a tension or load is applied along the axial direction

Peel strength 6.4.5 peel strength

The force perpendicular to the board surface required to strip a unit width of wire or foil from a clad or printed board

6 bow bow bow

A deformation of a laminate or printed circuit board to a plane. It can be roughly expressed by the curvature of a cylindrical or spherical surface. In the case of a rectangular board, its four corners lie in the same plane when it is bent

4.7 twist

A deformation of the plane of a rectangular plate. One of its angles is not in the plane containing the other three angles

4.8 camber

The degree to which the plane of a flexible board or flat cable deviates from a straight line

4.9 coefficient of thermal expansion (CTE)

Each unit temperature change causes a linear change in material size

4.10 thermal conductivity

The amount of heat per unit area and distance per unit of time and temperature gradient

4.11 dimensional stability

A measure of dimensional change caused by temperature, humidity, chemical treatment, aging, or stress

4.12 solderability

The ability of a metal surface to be wetted by molten solder

4.13 wetting solder wetting

The molten solder is coated on the base hole metal to form a uniform, smooth and continuous solder film

4.14 dewetting semi wetting

After the molten solder is coated on the surface of the base metal, the solder shrinks, leaving irregular solder bumps, but the base metal is not exposed

15 no wetting

The phenomenon that the molten solder contacts the metal surface only partially adheres to the surface and still exposes the base metal

4.16 ionic contaminant

The residual polar compounds, such as flux activator, fingerprint, etching solution or electroplating solution, can form water soluble polar compounds with free ions. When these pollutants are dissolved in water, the resistivity of water decreases


In order to check the gold image of materials, the method of preparing samples in advance is usually made by cutting the cross section, then pouring glue, grinding, polishing, etching, dyeing, etc

4.18 plated through hole structure test

Visual inspection of metal wires and plated holes after dissolving the substrate of printed circuit board

Floating welding test

Float the sample on the surface of the molten solder at the specified temperature for a specified time to test the ability of the specimen to withstand thermal shock and high temperature

4.20 machinability machinability

The ability of the laminate to withstand drilling, sawing, punching, shearing and other machining without splitting, crushing or other damage

4.21 heat resistance

The ability of a laminate specimen to stand in an oven at a specified temperature for a specified period of time without blistering

4.22hot strength retention

The percentage of the strength of the laminate in the hot state to that in the normal state

4.23 flexural strength

The stress that a material can bear when it reaches the specified deflection under bending load or when it breaks

24 tensile strength

Under the specified test conditions, the tensile stress that the specimen can bear when the tensile load is applied

25 elongation

The percentage of the increment of the distance between the effective parts of the specimen and the initial marking distance when the specimen is fractured under tensile load

Tensile modulus of elasticity

In the range of elastic limit, the ratio of tensile stress to corresponding strain produced by material

27 shear strength

The stress per unit area of a material during fracture under shear stress

28 tear strength

The force required to split the plastic film into two parts. The initial tear strength is defined as the specimen shape without slit, and the extended tear strength is the specimen with slit

4.29 cold flow

The deformation of non rigid materials under continuous load in the working range

4.30 flammability

The ability of a material to ignite under specified test conditions. In a broad sense, it includes the ignitability and continued combustion of the material

4.31 flaming combustion

Luminescent combustion of sample in gas phase

4.32 glowing combustion

The sample does not burn with flame, but the surface of the combustion zone can emit visible light

4.33 self extinguishing self extinction

The characteristics of materials to stop burning after the ignition source is removed under specified test conditions

4.34 oxygen index (OI)

Under specified conditions, the oxygen concentration required for flaming combustion of the sample is maintained in a mixture of oxygen and nitrogen, expressed as a percentage of oxygen volume

4.35 glass transition temperature

Temperature of amorphous polymer from glass brittle state to viscous flow state or high elastic state

4.36 temperature index (TI)

The centigrade value corresponding to a given time (usually 20000 hours) on the insulation thermal life diagram

4.37 fungus resistance

Resistance of materials to mold

4.38 chemical resistance

The resistance of materials to the action of acid, alkali, salt, solvent and other chemical substances, such as the weight, size, appearance and other mechanical properties of the material

4.39 differential scanning calorimetry

A technique for measuring the temperature dependence of the power difference input to a substance and a reference under programmed temperature control

4.40 thermal mechanical analysis

A technique for measuring the relationship between temperature and deformation of materials under non vibration load under programmed temperature control

5.5 prepreg and gluing film

5.1 volatile content

The content of volatile matter in prepreg material or coated film material is expressed as the percentage of volatile matter mass in sample to original mass of sample

5.2 resin content

The resin content in the laminate or prepreg, expressed as a percentage of the resin mass in the specimen to the original mass of the specimen

The flow rate of resin was 5

Flow behavior of prepreg or B-stage coated film under pressure

4 gel time

The time, in seconds, required for a prepreg or B-stage resin to pass from a solid state to a solid state under the action of heat

5.5 stack time

When the prepreg is heated at a predetermined temperature, the time required from heating to resin melting and reaching viscosity sufficient for continuous drawing

5.6 prepreg cured thickness

The average sheet thickness of prepreg pressed into laminate under specified temperature and pressure test conditions