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The basic process flow of PCBA assembly
2020-11-09
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Author:Holia      Share

With the development of PCBA assembly electronic products in the direction of miniaturization and high assembly density, the electronic assembly technology is also based on surface SMT mounting technology. However, there are still a certain number of through-hole plug-in components in some PCB circuit boards. The assembly of both plug-in components and surface mount components is called hybrid assembly, or hybrid assembly for short, and assembly that uses all surface mount components is called full surface mounting.


The PCBA assembly method and its process flow mainly depend on the type of assembly components and the assembly conditions. It can be roughly divided into four types: single-sided mounting technology, single-sided mixed mounting technology, double-sided mounting technology and double-sided mixed mounting technology.

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 Single-sided mounting process

Single-sided mounting means that all components are mounted and the components are assembled on one side of the PCB. The main flow of the single-sided mounting process: printing solder paste → patch → reflow soldering → cleaning → inspection → repair.


Single-sided mixed process

Single-sided mixed assembly refers to components that have both mounted components and plug-in components, and the components are assembled on one side of the PCB. The main process of the single-sided mixed assembly process: printing solder paste → patch → reflow soldering → plug-in → Wave soldering→cleaning→testing→rework.

Double-sided mounting process

Double-sided mounting refers to the assembly where all components are mounted and the components are distributed on both sides of the PCB. The main flow of the double-sided mounting process: A side printing solder paste → patching → reflow soldering → plug-in → pin bending → flipping board → B surface point patch glue → patching → curing → flipping board → wave soldering → cleaning →Inspection→Rework.
 

Double-sided mixed packaging process

Double-sided mixed assembly refers to the assembly of components with both mounted components and plug-in components, and the components are distributed on both sides of the PCB.


The main process of the double-sided mixed assembly process: A side printing solder paste → patch → reflow soldering → plug-in → pin bending → flipping board → B surface point patch glue → patching → curing → flipping board → wave soldering → cleaning →Inspection→Rework.