PCB Tech - PCB manufacturing and assembly revolution

Santa Clara, California, USA, August 1, 2007-Verdant Electronics announced today that they are developing a new technology that can revolutionize PCB manufacturing and assembly, and can greatly improve the method of electronic product manufacturing. This new technology is applying for a patent.

This new method significantly reduces the steps of electronic assembly, simplifies the process of PCB manufacturing and assembly, and can reduce costs and improve reliability.

A new supply chain model

The basic idea of this new technology is to use a process completely opposite to the traditional method for circuit interconnection assembly and manufacturing.

The significance of the manufacturing process of this opposite interconnection circuit is significant and far-reaching. Now, electronic manufacturing includes three parts: PCB board, electronic components and assembly. With this new method, the entire process becomes two parts, because PCB manufacturing and assembly are simplified into a continuous process.

A breakthrough in environmental protection-lead-free, solder-free assembly

The innovative concept of Verdant Electronics eliminates many inefficient processes in PCB manufacturing and assembly. A huge benefit is that it eliminates the solder in the assembly process, and the industry is making continuous efforts to move towards lead-free soldering.

Using the new method of Verdant Electronics will avoid the problems in the manufacture of lead-free electronic products, consume less energy and raw materials, have no restricted substances, and can make electronic products smaller, lighter, cheaper and more durable. This is a very green technology, fully in line with the current global trend of making more environmentally friendly electronic products.

Opposite process

Joseph (Joe) Fjelstad, the founder of Verdant Electronics and the inventor of the new technology, said this to the industry authority’s response to this technology: "The feedback given to me by experts who have seen this new technology makes me very happy. They expressed their high support for this technical idea, and more importantly, they provided very valuable opinions and suggestions to enable this technology to be better developed and applied, because the existing materials and equipment can be used. Realize this technology." Joseph (Joe) Fjelstad continued: "This technology was developed on the basis of the technology developed by GE and other manufacturers for microelectronics such as IC and module packaging in the 1990s, but the original technology Due to the low yield rate, it has not been widely used. Through the use of tested and sintered IC packages, the yield rate problem becomes related to the traditional PCB soldering assembly technology, so the yield rate problem can be easily solved. "Fjelstad pointed out: "Simplicity is the key to this method. As the 14th-century monk philosopher William of Occam said: "If you can be simple, you will not be complicated." This simple and clear thinking has now become Verdant Electronics' Guiding Principles."