Новости PCB - монтажная плата на расширение и сужение платы

влияние остатков меди внутри платы на набухание платы

There are many factors that affect the expansion and contraction of панель PCB, including the symmetry of the graphic design, the characteristics of the core material, the dimensional stability of the film, эксплуатационные проблемы в процессе производства, экологические вопросы, and so on. The following PCB board factory takes the influence of the residual copper rate of the inner layer of the circuit board on the expansion and contraction of the board as an example to make a simple summary.

трепать, трепать. For the expansion and contraction of the core board after the circuit board is сортhed (common four-layer circuit board laminated structure)

1. толщина 0.1 мм, and the Hoz core board with the surface copper thickness is larger than the core board with the surface copper thickness of 2oz.

- 2.... когда другие условия одинаковы, the surface copper Hoz core board has a large warp shrinkage, while the surface copper 2oz core board shrinks in the warp direction;

3. выход меди из платы оказывает заметное влияние на поверхность меди решетки хоз. чем ниже выход меди, the greater the expansion and contraction, и более значительные изменения в направлении.

- 2.... For the expansion and contraction of the core board after pressing (the pressing structure of the ordinary four-layer PCB board)

1. когда другие условия одинаковы, the weft shrinkage of the surface copper thickness 2oz core board is more obvious than that of the surface copper thickness Hoz core board;

2. одна и та же плата тип жилы плашка меридиан расширение направления, чем утка направление, and this phenomenon becomes more obvious as the copper thickness of the surface increases;

3. When other conditions are the same, Чем выше остаточная медь внутри пластины, стабильность размеров штамповки лучше, and the dimensional stability in the weft direction is better than that in the warp direction;

4. When other conditions are the same, the higher the residual copper rate in the inner layer of the circuit board, Чем меньше сжатие и сжатие пластины, это часто линейно, and the warp direction change is more significant;

5. When the residual copper rate of the inner layer of the circuit board is less than 40%, толщина жилы по толщине 0.1мм, 2oz толщиной больше. When it is greater than 40%, и наоборот.

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