Rigid Flex PCBA design and manufacturing
Reinforcing material: glass fiber cloth base
Insulating resin: polyimide resin (PI)
Product thickness: soft plate 0.15mm; Hard board 0.5mm; (tolerance ± 0.03mm)
Single chip size: it can be customized according to customer supplied drawings
Spessore del foglio di rame: 18 μ m(0.5oz)
Solder resist film / oil: yellow film / black film / white film / green oil
Coating and thickness: OSP (12um-36um)
Fire rating: 94-V0
Prova di resistenza alla temperatura: shock termico 288 ℃ 10 sec
Dielectric constant: Pi 3.5; AD 3.9;
Processing cycle: 4 days for samples; 7 days of mass production;
Storage environment: dark and vacuum storage, temperature < 25 ℃, humidity < 70%
Caratteristiche del prodotto:
1. iPCB can be customized to process HDI blind hole impedance process and other difficult Rigid Flex PCBA design and manufacturing;
2. sostenere OEM e ODM OEM, dalla progettazione di disegno alla produzione del circuito stampato e all'elaborazione SMT, e cooperare con i fornitori con servizio one-stop;
3. Strictly control the quality and meet the ipc2 standard;
Scope of application:
Products are widely used in mobile phones, home appliances, industrial control, industry and other fields.
