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Tecnologia PCB
Elaborazione della produzione di selezione di schede ad alta frequenza PCB
Tecnologia PCB
Elaborazione della produzione di selezione di schede ad alta frequenza PCB

Elaborazione della produzione di selezione di schede ad alta frequenza PCB


The definition of high-frequency board for circuit board production Scheda PCB ad alta frequenza si riferisce a un circuito speciale con una frequenza elettromagnetica più elevata, which is used in the fields of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter) The PCB is a circuit board produced on a microwave substrate copper clad board using part of the process of the ordinary rigid circuit board manufacturing method or using a special processing method. Generally speaking, una scheda ad alta frequenza può essere definita come un circuito con una frequenza superiore a 1 GHz!

Scheda PCB ad alta frequenza

Con il rapido sviluppo della scienza e della tecnologia, more and more equipment designs are applied in the microwave frequency band (>1GHZ) or even in the millimeter wave field (30GHZ). Ciò significa anche che la frequenza sta diventando sempre più alta, and the PCB circuit board The requirements for substrates are also getting higher and higher. Per esempio, the substrate material needs to have excellent electrical properties, buona stabilità chimica, and the loss on the substrate with the increase of the power signal frequency is very small, in modo da evidenziare l'importanza della scheda ad alta frequenza. 2. Scheda PCB ad alta frequenza campi di applicazione: prodotti di comunicazione mobile; amplificatori di potenza, amplificatori a basso rumore, ecc.;componenti passivi come splitter di potenza, attacchi, duplexers, filtri, ecc.;sistemi anticollisione automobilistici, sistemi satellitari, sistemi radio, e altri campi, L'alta frequenza delle apparecchiature elettroniche è la tendenza di sviluppo.
2. Scheda PCB ad alta frequenzaapplication fields: mobile communication products; power amplifiers, low-noise amplifiers, etc.; passive components such as power splitters, couplers, duplexers, filters, etc.; automotive anti-collision systems, satellite systems, radio systems, and other fields, The high frequency of electronic equipment is the development trend.
Classification of high frequency board powder ceramic filled thermosetting material

A. Manufacturer:
4350B/4003C from Rogers
Arlon's 25N/25FR
Taconic's TLG series
B. PCB circuit board processing method:
The processing process is similar to epoxy resin/glass woven cloth (FR4), tranne che il foglio è relativamente fragile e facile da rompere. When drilling and gongs, la durata della punta del trapano e del coltello gong è ridotta del 20%. PTFE (polytetrafluoroethylene) material
A. Produttore: RO3000 series, RT series, TMM series from Rogers
Arlon's AD/AR series, Serie IsoClad, CuClad series
Taconic's RF series, Serie TLX, TLY series
Taixing Microwave's F4B, F4BM, F4BK, TP-2
B. Processing method: 1. Cutting: The protective film must be kept for cutting to prevent scratches and creasing
2. Drilling
1. Use a brand new drill tip (standard 130), one by one is the best, the pressure of the presser foot is 40psi
2. The aluminum sheet is the cover plate, and then the PTFE plate is tightened with a 1mm melamine backing plate
3. Dopo la perforazione, use an air gun to blow out the dust in the hole
4. Use the most stable drilling rig and drilling parameters (basically the smaller the hole, the faster the drilling speed, minore è il carico Chip, the smaller the return speed)
3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is conducive to hole metallization
4.PTH copper sink
1 After the micro-incisione (the micro-etching rate has been controlled by 20 microinches), the PTH pulls from the de-oiler cylinder to enter the board
2 If necessary, go through the second PTH, just start the board from the expected cylinder
5. Solder mask
1 Pre-treatment: Use acidic plate washing instead of mechanical grinding plate
2 Baking plate after pretreatment (90, 30min), brush with green oil to cure
3 Baking plates in three stages: one section of 80, 100, 150, each for 30 minutes (if you find that the substrate surface is oily, you can rework: wash off the green oil and reactivate it)
6.Gong board
Lay the white paper on the circuit surface of the PTFE board, and clamp it up and down with the FR-4 substrate board or phenolic base plate with a thickness of 1.0MM inciso per rimuovere il rame, as shown in the figure: high-frequency board lamination method
The burrs on the back of the gong board need to be carefully trimmed by hand to prevent damage to the substrate and copper surface, e poi separati da una notevole dimensione di carta senza zolfo, and visually inspected. Per ridurre le sbavature, the key point is that the gong board process must have a good effect.
Process flow NPTH's PTFE sheet processing flow
Cutting-Drilling-Dry Film-Inspection-Etching-Erosion Inspection-Solder Mask-Characters-Spray Tin-Forming-Testing-Final Inspection-Packaging-Shipment
PTH's PTFE plate processing flow
Cutting-drilling-hole treatment (plasma treatment or sodium naphthalene activation treatment)-copper immersion-board electricity-dry film-inspection-diagram electricity-etching-corrosion inspection-solder mask-character-spray tin-molding-test-final Inspection-Packaging-Shipping
Summarize the difficulties of Scheda PCB ad alta frequenza processing
1. Immersion copper: the hole wall is not easy to be copper
2. Control of line gaps and sand holes of map transfer, etching, line width
3. Processo dell'olio verde: adesione dell'olio verde, green oil foaming control
4. Controllare rigorosamente i graffi della superficie del bordo in ogni processo.