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Liste des matériaux PCB

fiche technique isola 370hr

Liste des matériaux PCB

fiche technique isola 370hr

fiche technique isola 370hr

Industry Leading, Standard Loss, Thermally Robust Epoxy Laminate and Prepreg

Isola 370 heures is the industry's “best in class” lead-free compatible product for high-reliability applications across a wide range of markets.


Isola 370 heures laminates and prepregs, Conçu par polyclad, are made using a patented high performance 118.0.°C Tg FR-4.... multifunctional epoxy resin system that is designed for multilayer PCB applications where maximum thermal performance and reliability are required. Isola Manufacturing Isola 370 heures laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance.  Isola 370 heures provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials.


Isola 370 heures is used in thousands of PWB designs and has proven to be best in class for thermal reliability, CAF performance, ease of processing and proven performance on sequential lamination designs.


Typical Values of Isola 370 heures

PropertyTypical ValueUnitsTest Method
Metric (English)IPC - TM - 650 (ou tel que décrit ci - dessus)
Glass Transition Temperature (Tg) by DSC118.0..°C25c.4
Decomposition Temperature (Td) by TGA @ 5% weight loss340..°C2.4,24.6
Time to Delaminate by TMA (Copper removed)

A. T260

B. T218.18.

60

30

Minutes2.4,24.1
Axe Z Cte

A. Avant Tg

B. Post-Tg

C. 50 à 260 °C, (Total Expansion)

45..

230

2.18.

PPM / C

PPM / C

%

2.4,24c
X/Y-Axis CTEAvant Tg13/14PPM / C2.4,24c
Conductivité thermique0.4W/m·KASTM E19.52
Thermal Stress 10 sec @ 218.18.ºC (550.4ºF)

A. Unetched

Gravure

PassTransmettre des informations visuelles2.4.13.1
Dk, Permittivity

A. @ 100 MHz

B. @ 1 GHz

C. 2 GHz

@ 5ghz

E. @ 10 GHz

4,24

4.17

4.04

3.92

3.92

À

2.5.5.3

2.5.5.9

Barre d'or berès

Barre d'or berès

Barre d'or berès

Df, Loss Tangent

A. @ 100 MHz

B. @ 1 GHz

C. @ 2 GHz

@ 5ghz

E. @ 10 GHz

0.0150

0.0161

0.0210

0.0250

0.0250

À

À

À

2.5.5.3

2.5.5.9

Barre d'or berès

2.5.5.5

2.5.5.5

Volume Resistivity

A. Protection contre l'humidité

À haute température

3.0 x 10118..

7.0 x 1018.

M © cm2.5.17.1
Résistivité de surface

A. Protection contre l'humidité

À haute température

3.0 x 106

2.0 x 1018.

MΩ2.5.17.1
Dielectric Breakdown>50kV2.5.6b
Arc Resistance115Seconds2.5.1B
Electric Strength (Laminate & laminated prepreg)54 (1350)kV/mm (V/mil)2.5.6.2a
Comparative Tracking Index (CTI)3 (175-249)Class (Volts)UL 746A
ASTM D36318.
Résistance au décollement

A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 millions]

Cuivre standard

1. Après contrainte thermique

2. à 125 °C (257 °F)

3. After process solutions


1.14 (6.5)


1.25 (7.0)

1.25 (7.0)

1.14 (6.5)

N / mm (LB / in)

2.4.18.C


2.4.18..2A

2.4.18..3

2.4.18..3

Résistance à la flexion

Direction de la longueur

B. Direction transversale

90.0

77.

ksi2.4.4B
Tensile Strength

Direction de la longueur

B. Direction transversale

55,9

35.6

ksiASTM d3039
Module Young

Direction de la longueur

B. Cross direction

3744

31718.

ksiASTM D790-15e2
Poisson's Ratio

Direction de la longueur

B. Cross direction

0177

0.171

ÀASTM d3039
Moisture Absorption0.15%2.6.2.1A
Flammability (Laminate & laminated prepreg)V-0RatingUL 94
Relative Thermal Index (RTI)130°CUL 796