Model: Bonding Circuit Board
Matériau: fr - 4 TG = 130
Layer: 2 layer PCB
Couleur: vert / blanc
Finished Thickness: 1.0mm
Épaisseur du cuivre: 0,5 oz
Surface Treatment: Immersion Gold
Piste minimale: 4mil (1,0mm)
Espace minimum: 4 miles (1,0 mm)
Characteristic: Bonding Circuit
Applications: liaison IC