Rigid Flex PCBA design and manufacturing
Matériau de renforcement: base en fibre de verre
Insulating resin: polyimide resin (PI)
Product thickness: soft plate 0.15mm; Hard board 0.5mm; (tolerance ± 0.03mm)
Single chip size: it can be customized according to customer supplied drawings
Copper foil thickness: 18 μ m(0.5oz)
Solder resist film / oil: yellow film / black film / white film / green oil
Revêtement et épaisseur: OSP (12um - 36um)
Fire rating: 94-V0
Essai de résistance à la température: choc thermique 288 # 8451; 10 secondes.
Constante diélectrique: Pi 3,5; 3.9 A.D.;
Processing cycle: 4 days for samples; 7 days of mass production;
Product features:
1. iPCB can be customized to process HDI blind hole impedance process and other difficult Rigid Flex PCBA design and manufacturing;
2. Support OEM and ODM OEM, from drawing design to circuit board production and SMT processing, and cooperate with suppliers with one-stop service;
3. Strictly control the quality and meet the ipc2 standard;
Scope of application:
Les produits sont largement utilisés dans les téléphones mobiles, les appareils ménagers, le contrôle industriel, l'industrie et d'autres domaines.
