PCB-Neuigkeiten - Namensregeln für PCB-Bauteilbibliotheken

1. Integrated circuit (in-line)
   Use DIP-pin number + suffix to indicate dual in-line package
   There are two suffixes, N und W, to indicate the body width of the device
   N is a narrow package with a body width of 300mil und a pin pitch of 2.54mm
   W is the package with body width, die Körperbreite ist 600mil, und die Pin Pitch ist 2.54mm
   For example: DIP-16N represents a 16-pin narrow dual-in-line package with a body width of 300mil and a pin pitch of 2.54mm

2. Integrierte Leiterplatte circuit (SMD)
Use SO-pin number + suffix to indicate small outline SMD package
There are three suffixes of N, M and W to indicate the body width of the device
N is a narrow package with a body width of 150mil and a pin pitch of 1.27mm
M is a package between N and W, mit einer Körperbreite von 208mil und einer Stiftneigung von 1.27mm
W is the package with body width, die Körperbreite ist 300mil, und die Pin Pitch ist 1.27mm
For example: SO-16N represents a 16-pin small-outline chip package with a body width of 150mil and a pin pitch of 1.27mm
If SO is preceded by M, Es bedeutet, dass es sich um ein Mikropaket mit einer Körperbreite von 118mil und einer Stiftneigung von 0 handelt.65mm

3. Resistance
3.1 The naming method for SMD chip resistors is: package + R
Such as: 1812R represents a resistor package with a package size of 1812
3.2 The naming method for carbon film resistors is: R-package
For example: R-AXIAL0.6 stellt ein Widerstandspaket mit einer Pad-Neigung von 0 dar.6 inches
3.3 The naming method of cement resistance is: R-model
Such as: R-SQP5W represents a cement resistor package with a power of 5W

4. Capacitance
4.1 The naming method for non-polar capacitors and tantalum capacitors is: package + C
Such as: 6032C means that the package is 6032 capacitor package
4.2 The naming method of SMT monolithic capacitors is: RAD + pin spacing
For example: RAD0.2 means SMT monolithic capacitor package with a pin pitch of 200mil
4.3 The naming method of electrolytic capacitors is: RB+pin spacing/outer diameter
For example: RB.2/.4 means an electrolytic capacitor package with a pin pitch of 200mil and an outer diameter of 400mil

5. Diode rectifier device
The naming method is based on the actual package of the component, where BAT54 and 1N4148 are packaged as 1N4148

6. Transistor
The naming method is based on the actual package of the component. Q wird dem SOT-23Q-Paket hinzugefügt, um das SOT-23-Paket der integrierten Schaltung zu unterscheiden. Die anderen FETs verwenden den Komponentennamen als Paketnamen, um die Komponente fehlerfrei aufzurufen.

7, crystal oscillator
HC-49S, HC-49U sind Oberflächenmontagepakete, AT26, AT38 sind zylindrische Verpackungen, and the size of the digital meter
For example: AT26 represents a cylindrical package with an outer diameter of 2mm and a length of 8mm

8. Inductance and transformer parts
Inductive sealing package adopts TDK company package

9. Optoelectronic devices
9.1 The naming method of SMD LED is package + D to indicate
Such as: 0805D means light-emitting diode packaged as 0805
9.2 In-line light-emitting diodes are expressed as LED-outer diameter
For example, LED-5 represents a direct plug-in light-emitting diode with an outer diameter of 5mm
9.3 The nixie tube uses the device's own name naming

10. Plug
10.1 SIP + number of pins + pin spacing to indicate a single row of pins, Es gibt zwei Arten von Stiftabständen: 2mm, 2.54mm
For example: SIP7-2.54 bedeutet einen 7-poligen einreihigen Stift mit einer Stiftneigung von 2.54mm
10.2 DIP + number of pins + pin spacing to indicate double row of pins, Es gibt zwei Arten von Stiftabständen: 2mm, 2.54mm
For example: DIP10-2.54 bedeutet 10-polige zweireihige Stifte mit einer Stiftneigung von 2.54mm

The above is an introduction to the naming rules of PCB component libraries. Ipcb wird auch für Leiterplattenhersteller and Leiterplattenherstellung Technologie.