PCB Tech - PCB circuit board manufacturing packaging process

The PCB circuit board manufacturing and packaging process is as follows:

1. Process destination

The step of "packaging" is paid more attention to by PCB factories, and is usually less than the various steps in the manufacturing process. The main reason is that, of course, it does not generate added value on the one hand, and on the other hand, manufacturing industry has not paid attention to products for a long time. For the unmeasured benefits that packaging can bring, Japan has done the best in this regard. Carefully observe some of Japan's household electronics, daily necessities, and even food products. The same function will make people prefer to spend more money to buy Japanese goods. This has nothing to do with admiration of foreigners and Japan, but the control of the consumer's mentality. Therefore, the packaging will be discussed separately, so that the PCB industry knows that small improvements may have great results. Another example is that Flexible PCB is usually a small piece and the quantity is very large. Japan's packaging method may be specially molded for the shape of a product as a packaging container, which is convenient to use and has a protective effect.

2. Discussion on early packaging

Early packaging methods, please refer to the outdated shipping packaging methods in the table, detailing its deficiencies. There are still some small factories that use these methods for packaging.

Domestic PCB production capacity is expanding rapidly, and most of it is for export. Therefore, the competition is very fierce. Not only the competition among domestic factories, but also the competition with the top two PCB factories in the United States and Japan, in addition to the technical level and quality of the products themselves In addition to being affirmed by customers, the quality of packaging must be satisfied by customers. Almost large-scale electronics factories now require PCB manufacturers to ship packages. The following items must be paid attention to, and some even directly give specifications for shipping packaging.

1. Must be vacuum packed

2. The number of boards per stack is limited depending on the size is too small

3. The specifications of the tightness of each layer of PE film and the width of the margin

4. PE film and air bubble sheet (Air Bubble Sheet) specifications

5. Carton weight specifications and others

6. Are there any special provisions for buffering before placing the board inside the carton?

7. Specification of resistance rate after sealing

8. The weight of each box is limited

At present, the domestic vacuum skin packaging (Vacuum Skin Packaging) is similar, the main difference is only the effective working area and the degree of automation.

3. Vacuum Skin Packaging

Operating procedures

A. Preparation: Position the PE film, manually operate whether the mechanical action is normal, set the PE film heating temperature, vacuum time, etc.

B. Stacking board: When the number of stacked boards is fixed, its height is also fixed. At this time, how to stack it must be considered to maximize the output and save the material. The following are several principles:

a. The distance between each stack of boards depends on the specifications (thickness) and (standard 0.2m/m) of the PE film. Using the principle of being softened and elongated by heating, while sucking the vacuum, the coated board is pasted with the bubble cloth . The spacing is generally at least twice the total thickness of each stack. If it is too large, material will be wasted; if it is too small, it will be more difficult to cut and the sticking part will fall off easily or it will not stick at all.

b. The distance between the outermost board and the edge must also be at least twice the thickness of the board.

c. If the PANEL size is not large, according to the above-mentioned packaging method, materials and manpower will be wasted. If the quantity is very large, it can also be molded into containers similar to soft board packaging, and then PE film shrink packaging. There is another way, but it must be agreed by the customer to leave no gaps between each stack of boards, but separate them with cardboard, and take the appropriate number of stacks. There are also hard paper or corrugated paper underneath.

C. Start: A. Press start, and the heated PE film will be led down by the pressure frame to cover the table. B. Then the bottom vacuum pump will suck in air and stick to the circuit board, and stick it with the bubble cloth. C. Raise the outer frame after the heater is removed to cool it. D. After cutting the PE film, pull the chassis apart to separate each stack

D. Packing: If the customer specifies the packing method, it must be in accordance with the customer packing specification; if the customer does not specify, the factory packing specification must be established on the principle of protecting the board from external damage during the transportation process. Matters needing attention, As mentioned earlier, especially the packing of exported products must be paid special attention.

E. Other matters needing attention:

a. Information that must be written outside the box, such as "oral wheat head", material number (P/N), version, period, quantity, important information, etc. And the words Made in Taiwan (if export).

b. Attach relevant quality certificates, such as slices, weldability reports, test records, and various customer-required test reports, and place them in the manner specified by the customer. Packaging is not a question of the university. Doing it with your heart will save a lot of trouble that shouldn't happen.

The PCB circuit board manufacturing and packaging process is more complicated, and the PCB factory should operate carefully.