2021-07-17

The thin film circuit process of integrated circuits mainly used in the field of microwave and millimeter waves and other high-frequency circuits is the use of vacuum evaporation,

2021-07-23

In general, the specific properties of circuit board materials have a great deal to do with the performance of the final circuit board (PCB), especially at RF/ Microwave frequencies. The parameters such as the dielectric constant (DK), the dissipation factor (DF), and even the thickness of the material can affect the performance of different transmission lines (such as microstrip lines, strip lines, coplanar waveguides) in high-frequency circuits.

2021-07-22

The latest figures, announced by Liu Liehong, vice minister of industry and information technology, at the China Progress 2020 high-level forum on November 11 evening, show that China has built nearly 700,000 base stations this year, which is more than double the total of 5G base stations in the world outside China. The number of co-signatories for 5G terminals in China has exceeded 180 million so far.

2021-07-21

High frequency microwave antennas and high frequency microwave antenna arrays are the "eyes and ears" of all wireless systems. According to the IEEE Standard (145-1983), an antenna can be defined simply as "a device for transmitting and receiving radio waves".

2021-07-20

The company is engaged in the printed circuit board in the electronic industry, belonging to the manufacturing industry, the products are single, double-sided and multi-layer circuit board, circuit board assembly products, electronic equipment used wire and connectors, etc. Since its establishment, the company has been focusing on the production, sales and related after-sales service of all kinds of printed circuit boards. In the fierce market competition, the company has formed competitive advantages in technology, quality, cost, brand, scale and other aspects, ranking the leading position in the industry.

2021-07-19

High frequency and high speed board is the main material in telecommunication industry the telecommunications industry is looking forward to building a future in which co-signers are ubiquitous and truly connected to each other. To successfully achieve this goal, operators will continue to accelerate the rollout and expansion of 5G networks worldwide in 2021.

2021-07-17

With the continuous development of science and technology, especially information technology, the production of printed circuit board technology corresponding growth, to meet the needs of different users. In recent years, communication, transportation and other fields of development is very rapid, the need for printed boards has changed a little, the demand for high-power printed circuit boards, high frequency microwave board increased.

2021-07-16

Microstrip receiving antenna is a new type of receiving antenna which emerged in the 1970s. As early as 1953, Deschamps proposed the concept of making microstrip receiving antenna by using the radiation principle of microstrip line. It was not until the theoretical plate of microstrip transmission and the development of lithography on copper-coated media substrates that Munson and Howell et al. developed the first batch of practical microstrip receiving antennas.

2021-07-15

High Frequency printed circuit board (PCB) is a key building block for RF/microwave circuits -- essentially the starting point for these circuits. PCB materials come in many different forms, and the choice of material is largely dependent on the requirements of the intended application.

2021-07-14

The outstanding performance of silicon carbide (SiC) makes it a very important material for power semiconductor devices such as renewable energy systems and inverters for electric vehicles in a variety of application scenarios. However, the specific cost of SiC devices is higher and will continue to be higher than that of silicon (Si) devices, although this cost ratio may change in the future. Therefore, it is necessary not only to consider cost reduction in terms of compact layout and higher power density (kW/kg, kW/L), but also to minimize semiconductor expenditure. Multichip packaging and IC substrate technology plays a major role in this regard.