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2021-08-24
The main considerations for IC carrier substrates include dimensional stability, high-frequency characteristics, heat resistance and thermal conductivity and other requirements.
2023-05-05
Analog integrated circuits mainly refer to integrated circuits composed of capacitors, resistors, transistors, etc. that are integrated to process analog signals.
2023-01-18
When the line width and line spacing of PCB are less than 50 μ M (2mil), the traditional CCL's Subtractive Process (SP) is almost useless. Now, the line/width of CSP or FC cladding and other carrier plates is approaching 15 μ m/15 μ m.
2022-10-27
IC burning verification steps is a necessary process that is more important than IC testing.
2022-10-26
In the future, IC is necessary to include MCM (Multi chip Module) or SiP (System in Package) in the observation.
2021-10-16
PCB design Solution, I raised this question at the meeting and suggested optimizing these copper pavings.
Now, more and more electronics companies have begun to develop customized services for pcb board proofing. There is no f...
What is the thermal design in PCB processing? From what aspects do we need to understand this problem? The scope of appl...
2021-10-07
PCB process chip packaging technology detailed explanation1. BGA (ball grid array) is also called CPAC (globe top pad ar...
2021-10-02
However, if it can be done, PCB board made of semiconductor materials can also be regarded as PCB-sized integrated ICs.
2021-09-29
According to the PCB industry forecast and prospect analysis report released by Zhiyan Consulting, the current domestic ...
PCB multi-layer board lamination is a process in which one or more inner layers are etched and made into a multi-lay...
2021-09-28
The packaging technology of electronic smt chip processing circuit board, COB packaging, if the bare chip is directly ex...
What is a chipChips, also known as microcircuits, microchips, and integrated circuits (English: integrated circuit, IC)....
In the production of electronic products, PCB and IC are important components. However, many friends think that the two ...
HDI is the English abbreviation of High Density Interconnector, a high-density interconnect (HDI) manufacturing printed ...
2021-09-17
For a long time, IC carrier boards have not been taken seriously in the chip supply chain, because the product's g...
This paper will introduce some of the daily common IC Substrate packaging principle and functional characteristics, through understanding the packaging of various types of IC.
Abstract: IC chip (Integrated Circuit)is an integrated circuit formed by a large number of microelectronic components (t...
2021-09-16
Where does the open source EDA go?In particular, in the contemporary era where deep learning technology is closely integrated with the EDA field, an "ImageNet" in the field of chip design is needed to promote community prosperity.
