PCB Tech - Multilayer circuit board proofing methods and matters needing attention

Multilayer circuit board proofing methods and matters needing attention

In daily life and work, it is often necessary to use a variety of electronic equipment and mechanical equipment. They have long been inseparable from daily life, and they have become necessities of daily life. Such as computers, mobile phones, etc. And the key component of those devices is the PCB. PCB is also a circuit board, and the processing process of the circuit board is changed into multiple layers. Before the production and processing of the PCB, a multi-layer design and processing must be carried out. So, what are the main methods for multi-layer PCB proofing?

1. Use the additive method. This kind of method is to expose the necessary place through the combination of ultraviolet light and photoresist, and then use electroplating to thicken the certificate circuit, and then cover it with anti-etching resist or metal thin tin, and then cover the photoresist and the under The copper foil layer is etched away.

2. Use the subtraction method. This kind of method mainly uses chemicals to remove unnecessary places on the blank circuit board, and the remaining places are the necessary circuits. Multi-layer design processing mainly uses screen printing or photosensitive plates and engraving for processing. Remove unnecessary parts.

3. The method of the layered method. This kind of method is a very common method for multi-layer design and processing, and it is also the main method for making multi-layer printed circuit boards. It is through the process from the inner layer to the outer layer, and then using the subtractive or additive method to process, the process of repeating the layering method continuously, so as to realize the production of multi-layer printed circuit boards. One of the most critical processes is the build-up method, in which the printed circuit boards are added layer by layer and repeated processing is performed.

Multi-layer proofing refers to the whole process of PCB blank board passing through smt, and then passing through DIP plug-in, which is called multi-layer proofing. It is the behavior of the customer to perform the smt patch test again because of the need of the new product. Nowadays, multi-layer processing technology is widely used in life, and the fields involved are mainly concentrated in the field of science and technology.

Although the multi-layer processing technology is widely used in daily life, many people do not know what the documents should be when doing this work. After research, it is found that the documents that need to be prepared for multi-layer proofing mainly include the following:

First of all, we must prepare a complete and accurate BOM. Then provide a template Gerber file. Provide as much as possible the product tag silk screen image and patch coordinate file, and then the PCB file needs to be provided.

In addition to the above-mentioned documents that need to be prepared, there are some precautions that have to be mentioned when proofing. Because these precautions will make the whole work more efficient and make the quality of the product better. In the process of multi-layer processing, the following points need to be paid attention to:

First of all, when preparing materials for outbound SMT processing, in order to use extra ingredients in the production process, several single and double panels should be prepared. Other low-value preparations should also be prepared. However, large originals and chips can be prepared without much preparation.