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1. Commonly used circuit board surface treatment process in PCB circuit board factory
Nowadays, many electronic products are inseparable from the application of circuit boards, so this promotes the further development of PCB circuit board factories to a certain extent. Especially the circuit boards produced by professional PCB circuit board factories have excellent performance, and the good performance of circuit boards is inseparable from the application of surface treatment technology to many extents. So what are the commonly used circuit board surface treatment processes in PCB circuit board factories?
1. Hot air leveling. This is a very common and very cheap circuit board processing process for PCB circuit board factories. It refers to coating molten tin-lead solder on the surface of the circuit board and leveling (blowning) with heated compressed air to form a The layer can not only resist copper oxidation but also provide a coating layer with good solderability. During hot air leveling, the solder and copper form a copper-tin metal compound at the joint. The advantage is that it has a long storage time, and after the PCB is completed, the copper surface is completely wetted (completely covered with tin before soldering); suitable for lead-free soldering; mature technology, low cost, suitable for visual inspection and electrical testing.
2. The quality of the organic solderability protective agent is guaranteed. The PCB circuit board factory believes that the general process of this treatment process is: degreasing, micro-etching, pickling, pure water cleaning, organic coating, cleaning, and the process control is relative to other treatment processes. It's easier. This kind of processing technology used by PCB circuit board factories has outstanding advantages, for example: the process is simple, the surface is very flat, suitable for lead-free soldering and SMT. Easy to rework, convenient production and operation, suitable for horizontal line operation. The board is suitable for coexistence of multiple processes. Moreover, the cost is low and the environment is friendly.
3, Immersion gold Immersion gold is also a common processing method for PCB circuit board factories. The general process is: de-pickling cleaning, micro-etching, pre-soaking, activation, electroless nickel plating, and chemical immersion gold. There are 6 chemical tanks in the process, involving nearly a hundred chemicals, and the process is more complicated. The PCB circuit board factory is reported that this treatment process is not easy to oxidize, can be stored for a long time, and has a flat surface, which is suitable for welding fine-gap pins and components with small solder joints. And the PCB circuit board factory believes that this process can be repeated many times through reflow soldering without reducing its solderability, and it can also be used as a base material for COB bonding.
In general, the commonly used circuit board surface treatment processes in PCB circuit board factories mainly include hot air leveling, organic solderability protective agent and immersion gold. In addition, some PCB circuit board factories will also use immersion silver, tin and full boards. The surface of the circuit board is treated by methods such as nickel plating and gold, no matter which method is used, it is necessary to master the correct operation method to obtain good results.
Second, the way the PCB circuit board factory realizes heat dissipation
The PCB circuit board occupies a pivotal use in the electronic communication industry. The PCB circuit board factory claims that the heat dissipation capacity of the fpc flexible circuit board needs to be more cautious than the rigid circuit board. Therefore, the heat dissipation method of the fpc board needs to be considered when designing. The well-reputed PCB circuit board factory says that the heat dissipation method of fpc board can be realized in many ways, whether it is material or workmanship, it can effectively realize heat dissipation. The following PCB circuit board factory will introduce the fpc board to realize heat dissipation. Several ways:
1: Realize heat dissipation by using high-temperature heat-dissipating components. In order to ensure the heat dissipation effect of fpc electronic devices, high-temperature heat-dissipating components can be used to achieve effective heat dissipation. PCB circuit board manufacturers say that this method can achieve stable use from the operation of components and reduce heat. Dissipate and separate temperature-sensitive components from high heat dissipation sources during installation to avoid impact between components and reduce service life.
2: Use high thermal conductivity materials to speed up heat transfer. PCB circuit board manufacturers can also use high thermal conductivity materials to conduct heat to the radiator to shorten the transmission distance with the radiator to ensure better heat dissipation and also ensure The thermal connection between all the conduction paths is unblocked, so that the heat can be transferred at a relatively high speed during the propagation process to dissipate heat.
3: Increase the surface area to improve the heat dissipation performance. The increase in the surface area of the Fpc board can also effectively improve the heat dissipation performance. The PCB circuit board factory says that the surface area of the circuit board can be increased according to different usage requirements during the design. Achieve good circuit board heat dissipation efficiency. 4: Radiation heat dissipation method PCB circuit board factory claims that it can also increase the temperature of the radiator by using materials with high emission or strong absorption, so as to reduce the temperature of the absorber to achieve good heat dissipation performance, and reflect the radiator through geometric design Make it smaller to achieve good heat dissipation. This is also a way of radiating heat that is often seen.
The above is the four major fpc boards described by the PCB circuit board factory for everyone to realize the heat dissipation method. How to choose and use can be configured or used according to different usage needs. You can know in advance "Which PCB circuit board factory has better quality" "Only by choosing a good quality manufacturer can we design a good heat dissipation method for users and improve the heat dissipation performance of the PCB circuit board in actual use.
