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DEVELOPMENT AND PRODUCTION HIGH - END PCB

High Frequency PCB · HDI PCB · Flex-Rigid PCB · Buried and blind hole PCB

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The surface treatment process of multi-layer :ENIG
2019-07-04 15:14:44
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Blanking edge grinding → Drilling positioning hole → Inner layer etching → Inspection → Blackening → Lamination → Drilling → Thickening of copper deposition → Outer layer pattern → Tin plating, Etch to remove Tin → Second drilling → Inspection → Silk-screen → ENIG → Outline → E-test → Inspection

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