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2022-05-13
Rogers ULTRALAM3850 laminate circuit material uses high temperature resistant liquid crystal polymer (LCP) as the dielectric film.
2022-05-12
Rogers 2929 Bondply Series Data Sheet, Rogers prepreg 2929 has a hydrocarbon base material without glass fiber reinforcement inside, and is a thermoset material.
2022-05-02
Rogers RT/duroid 6202PR high frequency printed circuit board material is a low loss and low dielectric constant printed circuit board material with excellent electrical and mechanical properties.
2022-05-01
The advantages of RT Duroid PCB material, with ultra-low loss, low moisture absorption, stable dielectric constant (Dk) with frequency, low outgassing, suitable for aerospace applications, antenna systems and communication systems.
2022-01-22
SpeedWave 300P prepreg is a resin PCB material with low dielectric constant and ultra-low loss. It can be used to bond various high frequency PCB materials of Rodgers.
2022-01-09
RT/duroid 5880LZ is a low loss and high-reliability PTFE PCB board of Rogers Dk 2.0. It is difficult to make PTFE PCB materials. IPCB can mature to make high-frequency Rogers PCB with high difficulty.
2022-01-08
RO4500 series include RO4533, RO4534, and RO4535. Rogers RO4500 series microwave circuit PCB material is a high cost-effective PCB antenna-grade material of Rogers Company.
2021-08-27
Doosan DS-7409 HG (KQ) IC Package substrate material is Low Df, Halogen & phosphorous free. Applications, Flip chip BoC & RF module
2021-08-22
Tuc TU-900 and TU-900P are high Tg 260°C halogen-free multilayer PCB materials, of which TU-900 is Core and TU-900P is PP. TU-900 high Tg260°C PCB material is made of BT-like high performance resin system and alkali-free glass fabric.
TUC TU-872 SLK and TU-87P SLK have low Dk/Df and high thermal reliability PCB materials. TU-872 SLK is Core and TU-87P SLK is Prepreg (PP).
