Precision PCB Fabrication, High Frequency PCB, High Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB custom service factory.
| No. | Item | Description | Data and Model |
| 1 | FPC Main material | Brand | taiflex、graceth）、SY |
| 2 | PCB Material | Brand | SY、ITEQ、KB |
| 3 | Texture | Texture Brand | PI、 PET |
| 4 | Cover Film | Brand | taiflex、graceth、SY |
| 5 | Max Layers | LAYER | 1-14layers（sample）、1-12layers(manufacture） |
| 6 | Finish Board thickness | mm | 0.25-6.0mm(samplel） Rigid - Flex PCB 0.25-6.0mm |
| 7 | Min Pattern Width / Spacing | mm | 0.05mm/0.05mm |
| 8 | Max finish board size | mm | 230*450mm |
| 9 | Finish Board thickness tolerance | mm | ±50.05mm |
| 10 | PP Thickness | um | 12.5um 、 25um 、 50um |
| 11 | Copper thickness | um | 12um 、 18um 、 36um 、 70um |
| 12 | Stiffener materail | Variety | FR4/PI/PET/SUS/PSA |
| 13 | Surface treatment | Variety | ENIG、Immersion tin、OSP、immersion silver、plating gold |
| 14 | Min hole size | mm | Mechanical Hole ：0.15mm 、Laser Hole0.1mm |
| 15 | Hole tolerance | mm | NPTH:±0.05mm 、PTH:±0.075mm |
| 16 | Cover film color | Variety | Yellow 、 Black |
| 17 | PI thickness | mil | 0.5mil、0.7mil、0.8mil、1mil、2mil |
| 18 | Max number of layers of FPCB | 1-8layers | |
| 19 | Min finished size | mm | 5mm*8mm |
| 20 | Min pad | mm | inner layer（5mil）、outer layer（4mil） |
| 21 | Stiffener min size | mm | 4mm×5mm |
| 22 | Stiffener max size | mm | 32mm×32mm |
| 23 | Stifferner alignment accuracy | mm | ±0.075mm |
| 24 | Cover minimum openning size | mm | 0.6×0.6mm(steeling tooling)、0.5×0.5mm(Precision tooling) |
| 25 | Minimum openning spacing for covering film | mm | 0.5mm(Precision tooling)、0.2mm（Laser Routing）、 0.15mm(Normal drilling) |
| 26 | Coating film overflow amount（unilateral） | mm | Normal0.08-0.12mm 、 Limitation0.03mm |
| 27 | Min diameter of gold finger semicircle hole | mm | 0.25mm，Normal value0.3mm |
| 28 | Rigid-Flex PCB：Peel-off strength | N | 1.4N |
| 29 | Rigid-Flex PCB：Planeness | um | Less than 15um before baking; less than 30um after baking |
| 30 | Rigid-Flex PCB：thermal shock | ℃ | 288℃（3 times within 10 seconds） |
| 31 | Rigid-Flex PCB：W/B gold wire pull strength | g | > 6g |
| 32 | Rigid-Flex PCB：min.board thickness | mm | FPCB 0.1mm、4Layers 0.3mm、6Layers 0.5mm、8Layers 0.6mm、10Layers0.8mm |
