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HDI PCB Board

6Layers Micro SD card PCB

HDI PCB Board

6Layers Micro SD card PCB

6Layers Micro SD card PCB

Model : Micro SD card PCB

Material : isola fr408

Layer :6Layers 2+N+2 HDI

Color :Black/White

Finished Thickness : 0.3mm

Copper Thickness : inner1/3OZ,outer0.5OZ

Surface Treatment :Immersion Gold

Min Trace / Space :2.5mil/2.5mil

Min Hole :Mechanical hole 0.2mm,Laser Hole 0.1mm

Application :Micro SD card PCB


Product Details Data Sheet

Micro SD card is a very small flash memory card. Its format originated from SanDisk. It was originally called T-Flash and later renamed as trans flash. The reason why it was renamed micro SD was adopted by the SD Association (SDA). Other memory cards adopted by SDA include Mini SD and SD card.

Micro SD is mainly used in mobile phones, but because of its small size and increasing storage capacity, it has been used in GPS devices, portable music players and some flash memory disks. Its volume is 15mm x 11mm x1mm, which is almost the size of a fingernail. It is the smallest memory card at present.

Micro SD can also be connected to SD card slot through SD adapter card. Currently, microSD card provides 128MB, 256MB, 512MB, 1g, 2G, 4G, 8g, 16g, 32g, 64g, 128G capacity (during MWC 2014 World Mobile Communication Conference, SanDisk broke the tradition of memory card with the maximum capacity of 64GB, and officially released a micro SD XC memory card with a capacity of 128GB.

Micro SD card

Micro SD card

SD card PCB design considerations:

1. Pay attention to the accuracy of the item number and PCB name. The item number and PCB name include the name of the schematic diagram, the file name of schmetic under the schematic diagram, and the document description part in the lower right corner of the schematic diagram. Pins without network connection in schematic diagram should be crossed. If there is a network lead connector before, after deleting the network name, there is still a network name, such as net-xxx. At this point, DRC will make an error, and need to delete the lead completely and cross

2. The documents to be exported for PCB production include Gerber file and panel drawing. Pay attention to the material requirements to be indicated in the request for opening.

3. For SD card layout, the documents should be placed according to the actual needs. To ensure the accuracy of the files, coordinate positioning should be adopted. Note that the main control and flash should not be close to the edge, and at least 0.5mm space should be reserved for production.

4. Export CAD files to the engineering manager with the suffix DXF, and note that the unit is mm.

5. First of all, the primary and secondary relationship between each signal line should be clarified. The main signal line is CLK and VSD. Generally speaking, CLK signal line needs to be surrounded by ground wire or land.

6. After completing all wiring of ground signal, lay copper and observe to make the land as large as possible and the gap between signal lines as small as possible, so as to expand the land. The ground of the top floor and the bottom floor should be reliably connected. If there are copper sheets on both sides, more holes should be drilled for connection.

7. For the test points, try to distribute the test points in a balanced state, and the spacing should be consistent, so as to be more fixed.


Model : Micro SD card PCB

Material : isola fr408

Layer :6Layers 2+N+2 HDI

Color :Black/White

Finished Thickness : 0.3mm

Copper Thickness : inner1/3OZ,outer0.5OZ

Surface Treatment :Immersion Gold

Min Trace / Space :2.5mil/2.5mil

Min Hole :Mechanical hole 0.2mm,Laser Hole 0.1mm

Application :Micro SD card PCB



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