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How to look at the process capability of circuit board manufacturers
2021-08-24
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Author:Aure

How to look at the process capability of circuit board manufacturers

    I don’t know if you have noticed that on the websites of most circuit board manufacturers, we will always see the "Process Capability" column, which seems to indicate the strength of the circuit board manufacturers. In line with the curiosity of the people who eat melons, today the editor of will tell you what factors determine the process capability of circuit board manufacturers?
    1. Number of layers and plates
    Attention should be paid to the highest number of layers, surface treatment process, board thickness range, board thickness tolerance, and board type. At the same time, appropriate design software should be used to ensure the quality of PCB circuit board production.
    Combining these aspects with each other, if the final display of the circuit board is of good craftsmanship, it means that the circuit board manufacturer has a high process capability and can guarantee the quality of the circuit board.

How to look at the process capability of circuit board manufacturers

    2. Line graphics
    The circuit pattern includes the minimum line width and line spacing, the minimum network line width and line spacing, the minimum etched font width, the minimum BGA and bonding pads, the inner and outer copper thickness of the finished product, and the spacing between traces and outlines. Only by understanding and familiarizing with these parameters can the quality of the researched circuit graphics be high.
    3. Drilling and shape
    The details that should be paid attention to when drilling is the same as the line pattern mentioned in the first point. In terms of the shape, attention should be paid to the minimum slot cutter, the maximum size and the V-CUT to ensure that the shape is complete and clean.
    4. Characters and craftsmanship
    For characters, the minimum character width, height, line width, and patch character frame spacing and solder mask spacing should be mastered; and the process should pay attention to peeling strength, flame retardancy, impedance type, and special processes.
    5. Solder Mask and Jigsaw
    There are many types of solder masks. The solder mask bridge should be familiar with the design spacing between the pads; as for PCB imposition, attention should be paid to the gap problem and familiar with the PCB half-hole board splicing rules and multiple types of joint shipments.