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PCBA Tech
What are the factors that affect the quality of PCBA peak welding?
PCBA Tech
What are the factors that affect the quality of PCBA peak welding?

What are the factors that affect the quality of PCBA peak welding?

2021-12-10
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Author:pcb

The quality of wave soldering of PCBA board is not always to judge the quality of welding only from the surface phenomena when the PCB board is welded. The good quality PCB board should be analyzed and judged from the design source to the package shipment as a whole, and then find out the cause to avoid the bad phenomena. Next, based on the rich experience of IPCB, what are the factors that affect the quality of PCBA peak welding?

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The factors that affect the quality of PCBA peak welding during PCBA processing in PCBA board factories are as follows:


PCB boards are formed by PCB Factory designers arranging and assembling multiple electronic components on PCB boards through wiring and installation design according to the predetermined technical requirements. When arranging and assembling, the designer must abide by the technical constraints of PCBA peak welding and not act on his own. And hundreds of electronic components are arranged and combined, and then joined together with different metals using brazing. A large number of soldered joints need to be soldered in a few seconds at the same time. At this time, the body metal must have the ability of solderability and fast solderability, so the designer of PCB board manufacturer must select solderable materials when designing PCBA circuit boards.


PCBA process plants apply solder on the surface of the welded PCB circuit board, which helps to promote the wetness of solder to the metal on the welded PCB circuit board. It has been proved by effective practice that the strength and reliability of solder joints on PCB circuit board during PCBA processing operation in SMT patch factory are entirely dependent on the good wettability of solder to the soldered metal, so the selection of solder and solder with excellent performance in SMT technology is one of the factors that can not be ignored that directly affect the wetting effect.


Temperature, time and pressure conditions are also key factors in the metallurgical process of PCBA solder joints in PCBA plant. Therefore, the SMT technology shop equipment of PCB board manufacturer can maintain good peak welding equipment and reasonable process parameters selection and control, which are the basis to ensure the conditions of temperature, time and pressure. Only when the above requirements are fully taken into account, the PCBA peak welding process quality can achieve very good results.