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Special PCB

Special PCB

Special PCB

Special PCB

  • LED Ceramic PCB,Ceramic Substrate PCB
    LED Ceramic PCB,Ceramic Substrate PCB

    Model : LED Ceramic PCB,Ceramic Substrate PCB

    Material : Ceramic Substrate

    Layer : 2Layer Ceramic PCB

    Color : White

    Thickness : Aluminum nitride 0.635mm

    Copper Thickness : 1OZ(35um)

    Surface Treatment : Immersion Gold

    Gold thick : >=3U"

    Minimum aperture : 0.8mm

    Application : high power LED pcb,LED lamp pcb,LED street lamp pcb,solar energy inverter pcb


    Product Details Data Sheet

    Ceramic Based PCB is a kind of printed circuit board. Different from traditional FR-4 or aluminum substrate, it has thermal expansion coefficient close to semiconductor and high heat resistance. It is suitable for products with high calorific value (high brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environment.

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    Ceramic substrate PCB features:

    Structure: excellent mechanical strength, low warpage, thermal expansion coefficient close to silicon wafer (aluminum nitride), high hardness, good processability, high dimensional accuracy

    Climate: suitable for high temperature and high humidity environment, high thermal conductivity, good heat resistance, corrosion and abrasion resistance, anti UV & yellowing

    Chemistry: lead free, non-toxic, good chemical stability

    Electrical property: high insulation resistance, easy metallization, strong adhesion between circuit graphics and it

    Market: rich materials (clay, aluminum), easy to manufacture, low price


    Comparison of thermal properties (conductivity) of PCB materials:

    Glass fiber substrate (traditional PCB): 0.5w/mk, aluminum substrate: 1 ~ 2.2w/mk, ceramic substrate: 24 [alumina] ~ 170 [aluminum nitride] W / MK

    Material thermal conductivity (unit: w / MK)

    Resin: 0.5, alumina: 20-40, silicon carbide: 160, aluminum: 170, aluminum nitride: 220, copper: 380, diamond: 600

    Ceramic substrate process classification:

    It can be divided into thin film, thick film, low temperature co fired multilayer ceramics (LTCC)

    Thin film process (DPC): precise control element circuit design (line width and film thickness)

    Thick film: provide heat dissipation and weather resistance

    Low temperature co fired multilayer ceramics (HTCC): the glass ceramics have the characteristics of low sintering temperature, low melting point, high conductivity, and can be co fired with precious metals to realize multilayer ceramic substrate) and structure.

    LTCC: stack several ceramic substrates and embed passive components and other ICs

    The characteristics of AlN and alumina were compared

    The characteristics of AlN and alumina were compared:

    Alumina: easy to obtain materials, low cost, simple process, poor thermal conductivity

    Aluminum nitride: the material is not easy to obtain, the cost is high, the process is difficult, and the thermal conductivity is better



    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Model : LED Ceramic PCB,Ceramic Substrate PCB

    Material : Ceramic Substrate

    Layer : 2Layer Ceramic PCB

    Color : White

    Thickness : Aluminum nitride 0.635mm

    Copper Thickness : 1OZ(35um)

    Surface Treatment : Immersion Gold

    Gold thick : >=3U"

    Minimum aperture : 0.8mm

    Application : high power LED pcb,LED lamp pcb,LED street lamp pcb,solar energy inverter pcb



    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.