PCB Tech - How to improve the copper problem of cb circuit board

How to improve the copper problem of cb circuit board

In the PCB circuit board industry, the commonly used glass fiber double-sided circuit boards will need to sink copper in the holes, so that the vias have copper and become vias. However, after inspection during the production process,PCB manufacturers will occasionally find that there is no copper or copper unsaturated in the hole after the copper is deposited. Now the editor will briefly describe several reasons for everyone. The reason for the hole-free copper is nothing more than:
1. Drilling dust plug holes or thick holes.
2. There are bubbles in the potion when the copper is sinking, and the copper is not sinking in the hole.
3. Improper operation, too long stay in the micro-etching process.
4. There is line ink in the hole, the protective layer is not electrically connected, and there is no copper in the hole after etching.
5. The pressure of the punching board is too large, (the design punching hole is too close to the conductive hole) and the middle is neatly disconnected.
6. The acid-base solution in the hole is not cleaned after the copper is deposited or after the board is electrified, and the parking time is too long, resulting in slow biting corrosion.
7. Poor penetration of electroplating chemicals (tin, nickel).

Improve the cause of the hole-free copper problem.
1. Add high-pressure water washing and desmearing processes to holes that are prone to dust (such as 0.3mm or less aperture containing 0.3mm).
2. Set the timer.
3. Change the printing screen and counterpoint film.
4. Improve potion activity and shock effect.
5. Extend the washing time and specify how many hours to complete the graphics transfer.
6. Increase explosion-proof holes. Reduce the force on the board.
7. Do penetration testing regularly. So knowing that there are so many reasons that can cause the hole to have no copper open circuit, do you need to analyze it every time? Should we go to prevent and supervise in advance.

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