PCB Tech - What problems are prone to occur in the process of PCB plate making

When we design on PCB design software, it is often because of the seemingly connected parts (electrical performance) on the plane that are not actually connected. Therefore, when we start to make a plate based on the design file, the sequential operation is very important. . Today we use the following three methods to focus on solving the problems that are prone to occur in the process of PCB plate making.

1. Make a physical border

Making a closed physical frame on the original board is a constraint on the layout and wiring of the later components. Through the setting of a reasonable physical frame, the welding of the components and the accuracy of the wiring can be more standardized. But pay special attention to the fact that the physical borders of some curved edge boards or corners should also be set in an arc shape. The first is to prevent sharp corners from scratching workers, and the second is to reduce stress to ensure safety during transportation.

2. The introduction of components and networks

It should be very simple to draw the components and the network in the frame, but there are often problems here. You must carefully solve the errors one by one according to the prompts. Otherwise, it will take more effort. The problems here are generally as follows:

The package form of the component can not be found, the component network problem, there are unused components or pins, these problems can be solved quickly by comparison.

3. Layout standardization of components

(1) Placement order

Experienced installers will first place the components in fixed positions related to the structure, such as power sockets, indicator lights, switches, connectors, etc. Then lock it through the software to ensure that the fixed position of the components will move or affect when other components are placed later. For complex boards, we can divide them into the order of placement and operate them several times.

(2) Pay attention to the influence of layout on heat dissipation

The component layout should pay special attention to heat dissipation. For high-power circuits, the heating elements such as power tubes, transformers, etc. should be placed as close to the side as possible to facilitate heat dissipation. Do not concentrate in one place, and do not have high capacitors too close to avoid premature aging of the electrolyte.

Through the above three points, I hope to help the engineers who make PCB.