PCB Tech - PCB additive process

PCB additive process
The Internet era has broken the traditional marketing model, and a large number of resources have been gathered together to the greatest extent through the Internet, which has also accelerated the development speed of FPC flexible circuit boards, and then as the development speed accelerates, environmental problems will continue to appear in PCB factories. In front of him. However, with the development of the Internet, environmental protection and environmental informatization have also been developed by leaps and bounds. Environmental information data centers and green electronic procurement are gradually being applied to the actual production and operation fields.
The method of selectively depositing conductive metal on the surface of an insulating substrate to form a conductive pattern is called an additive method.

1. Advantages of the additive method

The printed board is manufactured using an additive process, and its advantages are as follows.

(1) Because the additive method avoids a large amount of etching of copper, and the resulting large amount of etching solution processing costs, the production cost of the printed board is greatly reduced.

(2) The additive process is reduced by about 1/3 compared with the subtractive process, which simplifies the production process and improves the production efficiency. In particular, it avoids the vicious circle that the higher the product grade, the more complicated the process.

(3) The additive process can achieve flush wires and flush surfaces, so that SMT and other high-precision printed boards can be manufactured.

(4) In the additive process, due to the simultaneous electroless copper plating of the hole wall and the wire, the thickness of the copper plating layer of the conductive pattern on the hole wall and the board surface is uniform, which improves the reliability of the metallized hole and can also meet the requirements of high thickness Diameter ratio printed boards, copper plating requirements in small holes.

2. Classification of additive methods

The additive manufacturing process of printed boards can be divided into the following three categories.

(1) Full Additive Process (Full Additive Process) is an additive process that only uses electroless copper to form conductive patterns. Take the CC-4 method as an example: drilling, imaging, viscosity-increasing treatment (negative phase), electroless copper plating, and resist removal. The process uses a catalytic laminate as the substrate.

(2) Semi-additive process (Semi-additive Process) On the surface of the insulating substrate, the metal is chemically deposited, combined with electroplating and etching, or the three are combined with an additive process to form conductive patterns. The process flow is: drilling, catalytic treatment and viscosity increasing treatment, electroless copper plating, imaging (electroplating resist), patterned copper electroplating (negative phase), resist removal, and differential etching. The substrate used in the manufacture is a common laminate.

(3) Partial Additive Process (Partial Additive Process) is to use the additive method to manufacture printed boards on the catalytic copper clad laminate. Process flow: imaging (anti-etching), etching copper (normal phase), removing the resist layer, coating the entire plate with electroplating resist, drilling a hole, electroless copper plating in the hole, and removing the electroplating resist. Our factory is located in China. For decades, Shenzhen has been known as the world's electronics R&D and manufacturing center. Our factory and website are approved by the Chinese government, so you can skip the middlemen and buy products on our website with confidence. Because we are a direct factory, this is the reason why 100% of our old customers continue to purchase on iPCB.