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PCB Material List

PCB Material List - F4BTME-1/2 Teflon woven glass fabric with ceramic filler copper-clad laminates

PCB Material List

PCB Material List - F4BTME-1/2 Teflon woven glass fabric with ceramic filler copper-clad laminates

F4BTME-1/2 Teflon woven glass fabric with ceramic filler copper-clad laminates

F4BTME-1/2 is laminated by laying up of the imported varnished glass cloth with Teflon PCB resin and filler with the Nano-ceramic membrane, according to the scientific formulation and strict technology process. The low roughness copper foil adopted. This product takes advantages over F4BM-2-A series in the electrical performance, improved the heat dissipation and have the small thermal expansion coefficient. PIM stability,applicable for the communication of 4G and 5G.


F4BTME-1/2 Technical Specifications

Appearance

Meet the specification requirements for the laminate of microwave PCB

by National and Military Standards.

Types

F4BTME-1/2

(255)

F4BTME-1/2

(265)

F4BTME-1/2

(285)

F4BTME-1/2

(294)

F4BTME-1/2

(300)

F4BTME-1/2

(320)

F4BTME-1/2

(338)

F4BTME-1/2

(350)

F4BTME-1/2

(400)

F4BTME-1/2

(440)



Dimension(mm)

610*460

600*500

1220*914

1220*1000

1500*1000


For special dimension,customized laminates is available.

Thickness and Tolerance(mm)

Laminate thickness

0.254

0.508

0.762

0.787

1.016

Tolerance

±0.025

±0.05

±0.05

±0.05

±0.05

Laminate thickness

1.27

1.524

2.0

3.0

4.0

Tolerance

±0.05

±0.05

±0.075

±0.09

±0.1

Laminate thickness

5.0

6.0

9.0

10.0

12.0

Tolerance

±0.1

±0.12

±0.18

±0.18

±0.2

Mechanical Strength

Cutting/punching

Strength

Thickness1mm,no burrs after cutting,minimum space between two punching holes is 0.55mm,no delamination.

Thickness1mm,no burrs after cutting,minimum space between two punching holes is 1.10mm,no delamination.

Peel strength(1oz copper)

Normal state:≥16N/cm;No bubble, delamination, peel strength≥14N/cm(in the constant humidity and temperature, and keep in the melting solder of 265 degree Celsius±2 degree Celsius for 20 seconds).


Thermal stress

After solder float,260ºC,10s,≥3 times,no delamination and blister.

Chemical Property

According to the properties of laminate,the chemical etching method for PCB can be used. The dielectric properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used.

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.1~2.8

Moisture Absorption

Dip in the distilled water of 20±2 degree Celsius for24 hours

%

≤0.05

Operating Temperature

High-low temperature chamber

degree Celsius

-50 degree Celsius~+260 degree Celsius

Thermal Conductivity


W/m/k

0.6~0.9

CTE

(typical)

-55~288 degree Celsius

(εr :2.55~3.0)

ppm/ degree Celsius

15(x)

15(y)

65(z)

CTE

(typical)

-55~288 degree Celsius

(εr :3.2~3.5)

ppm/ degree Celsius

15(x)

15(y)

55(z)

CTE

(typical)

-55~288 degree Celsius

(εr :4.0~4.4)

ppm/ degree Celsius

12(x)

14(y)

50(z)

Shrinkage Factor

2 hours in boiling water

%

 0.0002

Surface Resistivity

500V

DC

Normal state

M·Ω

≥1*106

Constant humidity and temperature

≥1*105

Volume Resistivity

Normal state

MΩ.cm

≥1*107

Constant humidity and temperature

≥1*106

Surface dielectric strength

Normal state

d=1mm(Kv/mm)

≥1.2

Constant humidity and temperature

≥1.1

Dielectric Constant

10GHZ

εr

2.85±0.05, 2.94±0.05

3.00±0.05, 3.20±0.05

3.38±0.05, 3.50±0.05

4.00±0.08, 4.40±0.1

Thermal Coefficient ofεr

(PPM/ degree Celsius)

-50150 degree Celsius

εr

Value

2.85,2.94

-85

3.0,3.2

-75

3.38

-65

3.5

-60

4.0

-60

4.4

-60

Dissipation Factor

10GHZ

tgδ

2.553.0

≤1.5*10-3

tgδ

3.03.5

≤2.0*10-3

tgδ

4.04.4

≤2.5*10-3


PIMD

2.5 GHZ

dbc

-163


UL Flammability

Rating

94 V-0