Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
PCBA Tech

PCBA Tech - About outsourcing PCBA processing technology introduction

PCBA Tech

PCBA Tech - About outsourcing PCBA processing technology introduction

About outsourcing PCBA processing technology introduction

2021-11-06
View:502
Author:Downs

1. Document provision and process:

Outgoing PCBA processing should strictly follow the bill of materials, PCB silk screen and outsourcing processing requirements for insertion or placement of components. When the material does not match the list, PCB silk screen, or contradicts the process requirements, or the requirements are ambiguous and cannot be operated At the time, you should contact our company in time to confirm the correctness of the material and process requirements.

2. Anti-static requirements:

1. All external PCBA processed components are treated as electrostatic sensitive devices.

2. All personnel who come into contact with components and products wear anti-static clothes, anti-static bracelets, and anti-static shoes.

3. During the raw materials entering the factory and in the warehouse stage, the electrostatic sensitive devices are all anti-static packaging.

6. During the operation, use an anti-static work surface, and use anti-static containers for the components and semi-finished products.

7. The welding equipment is grounded reliably, and the electric soldering iron adopts anti-static type. All must be tested before use.

8. The semi-finished PCB board is stored and transported in an anti-static box, and the isolation material uses anti-static pearl cotton.

9. The whole machine without shell uses anti-static packaging bag.

pcb board

Third, the requirements for the orientation of the component appearance mark:

1. The outsourcing PCBA processing components with polarity are inserted according to the polarity.

2. For components with silk-screened on the side (such as high-voltage ceramic capacitors), when inserted vertically, the silk screen faces right; when inserted horizontally, the silk screen faces down. When the components (not including the chip resistors) silk-printed on the top are inserted horizontally, the font direction is the same as the direction of the PCB screen printing; when inserted vertically, the upper side of the font faces right.

3. When the resistance is inserted horizontally, the error color ring faces to the right; when the resistance is inserted vertically, the error color ring faces down; when the resistance is inserted vertically, the error color ring faces the board.

Four, PCBA processing and welding requirements:

1. The pin height of the plug-in component on the soldering surface is 1.5~2.0mm. SMD components should be flat against the board surface, and the solder joints should be smooth, without burrs, and slightly arc-shaped. The solder should exceed 2/3 of the height of the solder end, but should not exceed the height of the solder end. Less tin, ball-shaped solder joints, or solder-covered patches are all bad;

2. The height of the solder joints: the height of the solder climbing pins should not be less than 1mm for the single-sided board, and the double-sided board should not be less than 0.5mm, and the tin must be penetrated.

3. Solder joint shape: Conical shape and covering the entire pad.

4. The surface of the solder joints: smooth, bright, no black spots, flux and other debris, no spikes, pits, pores, copper exposed and other defects.

5. Solder joint strength: fully wetted with pads and pins, no false soldering or false soldering.

6. Solder joint cross-section: the component's cutting foot should not be cut to the solder part as much as possible, and there should be no cracking on the contact surface between the lead and the solder. There are no spikes or barbs at the cross section.

7. Needle base welding: The needle base must be mounted on the bottom board, and the position is correct and the direction is correct. After the needle base is welded, the bottom floating height should not exceed 0.5mm, and the skew of the base body should not exceed the silk screen frame. Rows of needle holders should also be kept neat and not allowed to be misaligned or uneven.

5. PCBA transportation:

In order to prevent PCBA damage, the following packaging should be used during transportation:

1. Container: anti-static turnover box.

2. Isolation material: anti-static pearl cotton.

3. Placement spacing: there is a distance greater than 10mm between the PCB board and the board, and between the PCB board and the box.

4. Placement height: There is a space greater than 50mm from the top surface of the turnover box to ensure that the turnover box is not pressed against the power supply, especially the power supply of the wire.

6. PCBA washing requirements:

The board surface should be clean and free of tin beads, component pins, and stains. Especially at the solder joints on the plug-in surface, there should not be any dirt left by soldering. The following devices should be protected when washing the board: wires, connecting terminals, relays, switches, polyester capacitors and other easily corrosive devices, and the relays are strictly prohibited to be cleaned by ultrasonic.

Seven, all components are not allowed to go beyond the edge of the PCB board after the installation is completed.

8. PCBA furnace requirements:

Because the pins of the plug-in components are scoured by the tin flow, some plug-in components will be tilted after being soldered through the furnace, causing the component body to exceed the silk screen frame. Therefore, the repair welding personnel after the tin furnace are required to make appropriate corrections.