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In-depth analysis of SMT steel mesh wipe paper
PCBA Tech
In-depth analysis of SMT steel mesh wipe paper

In-depth analysis of SMT steel mesh wipe paper

2021-11-09
View:148
Author:Downs

SMT steel mesh wiping paper, also called SMT automatic wiping paper, SMT roller wiping paper, SMT dust-free roll paper, SMT wiping roll paper, etc.

1. Material

Using natural wood pulp and polyester fiber as raw materials, it is processed by a unique spunlace method to form a unique wood pulp/polyester double-layer structure.

2. Performance

Strong and durable, with high water and oil absorption, soft, dust-proof and anti-static performance.

The material is soft, does not produce any scratches on the surface of the cleaning object, and does not damage the surface of the object.

Can be used with cleaning solution.

Super liquid absorption capacity, more than four times faster than ordinary cotton wipes.

Efficiently remove water stains and oil stains without using any chemical adhesives.

pcb board

Because it is produced in a clean room, it avoids the inclusion of impurities in the wiping paper, which can reduce the printing process

The stencil wipes entrained impurities and cause printing defects.

It can be matched with anti-static packaging to meet the strict anti-static requirements for electronic products.

3. Type

Plain paper and grid paper, imported UFP material

4. Parameters

Unit weight 56, 60g, 65g, 68 g/m2

Thickness 0.3-0.35 mm

Width 20-800cm

5. Lined pipe

Paper tube and PVC plastic tube.

The two ends of the tubes used in different printing models are either slotted or not slotted.

6. Application

It is used for cleaning high-standard surfaces. It is a special wipe paper for SMT printing of electronic industry circuit boards. It can effectively remove excess solder paste and red glue attached to the stencil of the printing machine and circuit boards, and keep the electronic circuit boards spotless. Greatly reduce the scrap rate, greatly improve production efficiency and product quality.

It can be used for all automatic printing models such as MPM, DEK, KME, YAMAHA, MINAMI, JUKI, EKRA, PANASERT, FUJI, SANYO, etc.

7. Specifications

The width and length of the dust-free paper and the diameter and length of the inner tube are all determined by the size of the actual printed product and the printing model.

8. Opening

Operators who often use SMT stencil wipe paper may have this problem, that is, some products are very effective in use, but some products are very unsatisfactory in use. The reason for this problem is that some factors will affect its use.

1. It is related to the retention rate of fine fibers in the forming section: In the production process, we usually use 80 mesh carbon mesh, and fine fibers below one millimeter account for about 5% of the total. If the vacuum in the forming section is controlled It can improve the bulkiness of SMT stencil wipe paper by reducing the loss rate of fine fibers or recycling them.

2. Fluff pulp factors: the longer the fiber of the fluff pulp, the higher the roughness, and the better the bulkiness of the final paper; the bulkiness of kraft pulp is better than that of kraft pulp; softwood pulp will It has better bulkiness than hardwood pulp; untreated pulp has better bulkiness than treated pulp.

3. It is related to the texture of the transfer net (embossed net) used. The bulkiness of the SMT stencil wiper paper produced by the plain weave is much better than that of other large nets;

4. The temperature of the compactor and embossing machine: the higher the pressure, the tighter the SMT stencil wiper paper will be pressed, the worse the bulkiness, and the smaller the thickness;

5. The bulkiness of high-quantity products is better than that of low-quantity products. This is because high-quantity products have a high retention rate of fine fibers during forming. On the other hand, high-quantity products have a relatively low amount of glue used per unit. .

For SMT stencil wiping paper, in addition to the above five factors, the main factor that affects the bulk and thickness index is the temperature of the oven. Within the allowable range of the production process, if the temperature is higher, the hot melt bonding The better the situation, the higher the bulkiness and thickness.