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PCB Tech

PCB Tech - How to easily complete the PCB circuit board design

PCB Tech

PCB Tech - How to easily complete the PCB circuit board design

How to easily complete the PCB circuit board design

2021-08-31
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Author:Aure

How to easily complete the PCB circuit board design

PCB circuit board is one of the most important components in the electronics industry, and almost every electronic device needs to use it. Its design can not only directly affect the quality of the entire electronic product, but also is closely related to the cost, and can even influence the success or failure of commercial competition. It’s not easy to say, but it’s not too difficult to say. Just follow these steps and you can easily complete the PCB circuit board design.

1. Pay attention to the relationship between PCB circuit board vias, pads, traces and golden fingers:

During routing, the vias should not be too close to the pads, traces, and gold fingers. The vias of the same attribute should be kept at least 0.12mm away from the gold fingers, and the vias of different attributes should be kept away from the pads and gold fingers. The minimum via hole should be 0.35mm for outer hole and 0.2mm for inner hole.


How to easily complete the PCB circuit board design

2. Pay attention to the size and spacing of the pads:

The minimum size of bonding pads (single wire) is 0.2mmX0.09mm90 degrees, the minimum spacing of each pad is 2MILS, and the pad width of the inner row of ground and power lines is also required to be 0.2mm. At the same time, the angle of the bonding pad should be adjusted according to the angle of the component pulling wire.

3. Pay attention to the distance between the pad and the original:

The distance between the SMT pad and the DIE bonding pad and the SMT component should be kept at least 0.3mm, and the distance between one DIE bonding pad and the other DIE should also be kept at least 0.2mm. The minimum signal trace is 2MILS, the spacing is 2MILS, and the main power trace is preferably 6-8MILS to enhance the strength of the substrate.

4. Pay attention to the manufacturing process of the substrate:

Each wire must be electroplated to form copper pads and traces by electroplating. Even for pads without a network, the pads must be copper-plated in a certain mode, otherwise the phenomenon will appear. The result of no copper on the pad.

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