PCB Tech - Why does the mobile phone wireless charging FPC factory have development prospects?

FPC has excellent performance and demand-driven growth beyond the industry level. The FPC of the mobile phone wireless charging soft board factory has the advantages of high wiring density, small size, light and thin, consistent installation and connection, foldable bending, three-dimensional wiring, etc., which conforms to the trend of intelligence, portability, and lightness in the downstream electronics industry. The compound growth rate of FPC output value from 2009 to 2019 was 6%, higher than the 4.1% growth rate of the PCB industry. FPC's global output value was 12.2 billion U.S. dollars in 19 years, accounting for 20% of PCB output value.

Demand side: downstream applications are booming, and multiple fields open up the FPC market space. From an industry perspective, smart phones are the largest application field of FPC, accounting for 29%. From a brand perspective, it is estimated that Apple is currently the largest demander of FPCs. High, corresponding to stronger profitability of manufacturers. From the application side, in the future, we judge that the future of 5G+ mobile phone innovation, VR/AR, IoT, and automotive electronics will be booming, which is expected to open up the FPC market space + increase usage and value.

Supply side: The global FPC market share is relatively concentrated. Domestic manufacturers mainly cut into FPC through acquisitions, showing a two-super-strong + small-scale pattern. In addition, domestic manufacturers are actively expanding production and accepting overseas FPC manufacturers to withdraw from the market. The global FPC market is highly concentrated. In 2018, CR3=58%. Domestic FPC manufacturers mainly include: listed companies Pengding Holdings, Hongxin Electronics, Jingwang Electronics, Suntak

Technology, etc., ipcb soft board factories, etc., showing two super + public Small situation; from the perspective of changes in output value, Chinese manufacturers from 15 to 18 years due to their own active expansion + customer market share increase + external PCB industry transfer and other factors, the output value has shown a relatively high growth rate. Japanese and Korean manufacturers have been focusing on Application areas with higher profit margins + weak willingness to expand production + capacity withdrawal and other reasons, the average output value is reduced, in the future, domestic manufacturers will orderly expand production and continue to accept overseas FPC manufacturers to withdraw from the market.

There is a lot of room for localization of soft board raw materials, and PTFE is expected to become the trend of soft board base materials. The FPC industry chain includes upstream raw material suppliers: copper foil base material CCL, cover film CVL, reinforcement sheet, glue, electromagnetic shielding film, SMT process providers and equipment suppliers such as laser drilling machines, electroplating machines, and exposure machines (The ability of SMT to print parts has a greater impact on the profitability of manufacturers), midstream FPC manufacturers, downstream manufacturers of electronic product module components and terminal electronic product manufacturers. At present, FPC raw materials FCCL, copper foil, and electromagnetic shielding film are mainly monopolized by Japanese and Korean manufacturers, and there is a large room for localization.