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IC Substrate

IC Substrate

IC Substrate

IC Substrate

  • SiP Package Substrate
    SiP Package Substrate

    Product Name: SiP Package Substrate

    Material: Shengyi SI10U

    Layers: 6L

    Thickness: 0.5-0.6mm

    Single size: 35 * 35mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: ENEPIG

    Minimum aperture: 0.075/0.1mm

    Minimum line distance: 30um

    Minimum line width: 50um

    Application: SiP package IC Substrate PCB Board

    Product Details Data Sheet

    When product functions are increasing, and the space layout of the circuit board is limited, and no more components and circuits can be designed, the designer will integrate this PCB board function with various active or passive components on an IC chip, In order to complete the design of the entire product, namely SIP application.

    sip substrate

    SiP package IC Substrate PCB board advantages:


    1. Small size

    In the same function, the SIP module integrates a variety of chips, and relatively independently packaged ICs can save PCB space.


    2. Fast time

    The SIP module board is a system or subsystem, used in a larger system, the debugging stage can complete the prediction and pre-audit faster.


    3. Low cost

    Although the price of SIP module is more expensive than a single part, the PCB space is reduced, the failure rate is low, the test cost is low, and the system design is simplified, which reduces the overall cost.


    4. High production efficiency

    Through the integration and separation of passive components in SIP, the defect rate is reduced, thereby increasing the overall product yield. The module adopts high-level IC packaging technology to reduce system failure rate.


    5. Simplify system design

    SIP integrates complex circuits into modules, reducing the complexity of PCB circuit design. SIP module provides quick replacement function, allowing system designers to easily add required functions.


    6. Simplify system testing

    The SIP module has been tested before shipment, which reduces the testing time of the whole system.


    7. Simplify logistics management

    The SIP module can reduce the number of items and the number of materials prepared in the warehouse, and simplify the production steps.


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.

    Product Name: SiP Package Substrate

    Material: Shengyi SI10U

    Layers: 6L

    Thickness: 0.5-0.6mm

    Single size: 35 * 35mm

    Resistance welding: PSR-4000 AUS308

    Surface treatment: ENEPIG

    Minimum aperture: 0.075/0.1mm

    Minimum line distance: 30um

    Minimum line width: 50um

    Application: SiP package IC Substrate PCB Board


    For pcb technical problems, ipcb knowledgeable support team is here to help you with every step. You can also request pcb quotation here. Please contact E-mail sales@ipcb.com

    We will respond very quickly.