Precision PCB Fabrication, High-Frequency PCB, High-Speed PCB, Standard PCB, Multilayer PCB, and PCB Assembly.
The most reliable PCB & PCBA custom service factory.
IC Substrate

SiP Package Substrate

IC Substrate

SiP Package Substrate

SiP Package Substrate

Product Name: SiP Package Substrate

Material: Shengyi SI10U

Layers: 6L

Thickness: 0.5-0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.075/0.1mm

Minimum line distance: 30um

Minimum line width: 50um

Application: SiP package IC Substrate PCB Board

Product Details Data Sheet

When product functions are increasing, and the space layout of the circuit board is limited, and no more components and circuits can be designed, the designer will integrate this PCB board function with various active or passive components on an IC chip, In order to complete the design of the entire product, namely SIP application.

sip substrate

SiP package IC Substrate PCB board advantages:


1. Small size

In the same function, the SIP module integrates a variety of chips, and relatively independently packaged ICs can save PCB space.


2. Fast time

The SIP module board is a system or subsystem, used in a larger system, the debugging stage can complete the prediction and pre-audit faster.


3. Low cost

Although the price of SIP module is more expensive than a single part, the PCB space is reduced, the failure rate is low, the test cost is low, and the system design is simplified, which reduces the overall cost.


4. High production efficiency

Through the integration and separation of passive components in SIP, the defect rate is reduced, thereby increasing the overall product yield. The module adopts high-level IC packaging technology to reduce system failure rate.


5. Simplify system design

SIP integrates complex circuits into modules, reducing the complexity of PCB circuit design. SIP module provides quick replacement function, allowing system designers to easily add required functions.


6. Simplify system testing

The SIP module has been tested before shipment, which reduces the testing time of the whole system.


7. Simplify logistics management

The SIP module can reduce the number of items and the number of materials prepared in the warehouse, and simplify the production steps.

Product Name: SiP Package Substrate

Material: Shengyi SI10U

Layers: 6L

Thickness: 0.5-0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.075/0.1mm

Minimum line distance: 30um

Minimum line width: 50um

Application: SiP package IC Substrate PCB Board


For PCB technical problems, iPCB knowledgeable support team is here to help you with every step. You can also request PCB quotation here. Please contact E-mail sales@ipcb.com

We will respond very quickly.